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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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SEMI Applauds Initiatives to Bolster Semiconductor Manufacturing, Research in American Jobs Plan
April 5, 2021 | SEMIEstimated reading time: Less than a minute
SEMI, the industry association serving the global electronics design and manufacturing supply chain, applauded the inclusion of initiatives to strengthen U.S. semiconductor manufacturing and research and calls for investment in the Biden Administration’s American Jobs Plan. In addition to calling on Congress to invest $50 billion in semiconductor manufacturing and research, in line with the bipartisan CHIPS for America Act, the plan lists semiconductors as a field of focus in its call for an investment of another $50 billion in the National Science Foundation (NSF).
“Reversing the 50% decline in the U.S. share of semiconductor manufacturing capacity over the past 20 years requires bold action, and the Biden administration’s support for significant funding to bolster the industry in its American Jobs Plan is an important step forward,” said Ajit Manocha, SEMI president and CEO. “Funding the authorized CHIPS For America Act provisions and enacting an investment tax credit to support investment in the U.S. semiconductor supply chain will make the United States a globally competitive location for new semiconductor facilities. The plan’s focus on addressing workforce development in the industry is encouraging as well, as the competition for talent is intensifying to support projected growth.”
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Statement from the Global Electronics Association on the July 2025 Tariff on Copper Foil and Electronics-Grade Copper Inputs
07/31/2025 | Global Electronics AssociationWe are disappointed by today’s decision to impose a 50% tariff on imported copper foil and other essential materials critical to electronics manufacturing in the United States.
LQDX Inc. Completes Sale of Aluminum Clad Laminate IP to Toyo Aluminium K.K.
07/31/2025 | PR NewswireLQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has completed the divestiture of its Aluminum Clad Laminate IP – known as ACL™ – to Toyo Aluminium K.K., a Japan-based global market leader in specialty aluminum-based products for the consumer, electronics and automotive sectors.
Hon Hai Technology Group (Foxconn) and TECO Announce Strategic Alliance Targeting AI Data Center Capabilities
07/31/2025 | Hon Hai Technology GroupHon Hai Technology Group (“Foxconn”) and TECO Electric & Machinery Co Ltd (“TECO”) on Wednesday announced a share exchange, strategic alliance that will strengthen their AI infrastructure capabilities and propel the two Taiwanese tech majors into key markets in the global super-computing race.
Considering the Future of Impending Copper Tariffs
07/30/2025 | I-Connect007 Editorial TeamThe Global Electronics Association is alerting industry members that a potential 50% tariff on copper could hit U.S. electronics manufacturers where it hurts.
Foxconn, TECO Announce Strategic Alliance Targeting AI Data Center Capabilities
07/30/2025 | PRNewswireHon Hai Technology Group (Foxconn) and TECO Electric & Machinery Co Ltd Ltd (TECO) on Wednesday announced a share exchange, strategic alliance that will strengthen their AI infrastructure capabilities and propel the two Taiwanese tech majors into key markets in the global super-computing race.