Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
L3Harris Technologies Selected for Future US Weather Satellite Imager Design Phase Study
April 6, 2021 | L3Harris TechnologiesEstimated reading time: 1 minute
NASA has selected L3Harris Technologies to develop a concept for the next generation of geostationary weather imagers which will help advance future severe storm tracking, weather forecasting, climate and other Earth observations.
L3Harris will develop an imager design, as well as conduct technology development and analysis for the U.S. National Oceanic and Atmospheric Administration’s (NOAA) Geostationary and Extended Orbits (GEO-XO) satellite system. The GEO-XO mission will eventually replace the agency’s current Geostationary Operational Environmental Satellite-R (GOES-R) series of weather satellites, which includes the L3Harris-built primary payload.
“L3Harris will leverage its five decades of engineering and manufacturing experience building space-based imaging systems to develop the next-generation weather satellite concept,” said Ed Zoiss, President, Space and Airborne Systems, L3Harris. “The new imager will support NOAA’s efforts to continually improve Earth observations from geostationary orbit—a critical capability which protects the lives and property of our nation's citizens.”
The L3Harris GEO-XO next-generation imager will include additional spectral bands, higher spatial resolution, and improved data compression algorithms. These features, combined with flexible and efficient scan capabilities, will provide improved severe storm tracking, weather forecasting, enhanced fire/smoke detection, as well as other vital benefits to government users, scientists and our nation.
Supported by NASA, NOAA’s GEO-XO program is scheduled for launch in the early 2030s. L3Harris is the industry-leading provider of weather sensors flown by U.S. and international customers, such as NOAA’s Advanced Baseline Imager for the GOES-R satellite series, Cross Track Infrared Sounder for the Joint Polar Satellite System, Japan’s Advanced Himawari Imagers for the Himawari mission, and South Korea’s Advanced Meteorological Instrument for GEOKompsat-2a.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Orbel Corporation Integrates Schmoll Direct Imaging
06/04/2025 | Schmoll AmericaOrbel Corporation in Easton, PA, proudly becomes the first PCM facility in the U.S. equipped with Schmoll’s MDI Direct Imaging system. This installation empowers Orbel to support customers with greater precision and quality.
Key Insights on Photoresist for Defect Reduction
05/21/2025 | I-Connect007 Editorial TeamIn PCB manufacturing, understanding the intricacies of the photoresist process is crucial for achieving high-quality results. Industry experts Josh Krick, a technical service engineer at IEC, and Tim Blair, a PCB imaging specialist at Tim Blair LLC, share their knowledge on the essential stages of photoresist application, highlight critical advancements in materials, and discuss common defects encountered during production. They share best practices and innovative solutions to enhance the manufacturing process, reduce defects, and ensure efficiency and reliability in high-tech applications.
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.