-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Saki to Exhibit Latest 3D-SPI and 3D-AOI System Solutions at NEPCON China 2021
April 7, 2021 | Saki CorporationEstimated reading time: 2 minutes
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting its latest 3D Solder Paste Inspection (SPI) and 3D Automatic Optical Inspection (AOI) systems on two booths at NEPCON China 2021. Visitors to the event are invited to interact with Saki equipment on the FUJI CORPORATION (FUJI) booth #1G60 and on the Shanghai Cent-Sun Electronic Co., Ltd. (CSE) Booth #1J25 where Saki will introduce its new innovative Z-axis optical-head control feature. The thirtieth NEPCON China exhibition will run from April 21 - 23 at the Shanghai World Expo Exhibition and Convention Center.
On booth #1J25, in collaboration with CSE, its China market distributor, Saki will show the large format 3Si-LD2 3D Solder Paste Inspection (SPI) system along with two models from its 3Di Series of AOI machines: the 3Di-LS2 and 3Di-LD2, which are the single-lane and dual-lane variants respectively of the company’s new large format 3D AOI machines. Saki’s 3Di Series AOI machines can all be fitted with the new Z-axis solution to achieve inspection of tall components, press-fit components and PCBAs in jigs. A maximum height-measurement range in 2D and 3D mode up to 40mm is made possible. Visitors to the CSE booth will experience a live demonstration of the newly developed Z-axis system.
The 3Di-LS2 and 3Di-LD2 platforms support board sizes up to 19.7 x 20.07 inches (500 x 510mm) and are available in three resolutions of 7?m, 12?m and 18?m. Saki L size AOI and SPI systems share many hardware and software characteristics designed to reduce running costs for customers.
On the FUJI booth #1G60, the compact Saki 3Di-MS2 AOI system will be featured in a special display area entitled ‘SiP and module board solutions’ within an SMT assembly line equipment configuration. As part of Saki’s 3Di Series, the 3Di-MS2 applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
“We are excited to be exhibiting with our China distribution partner CSE and collaborating with FUJI in its dedicated System in Package and module board solutions area,” says Zheng Ri, General Manager of Saki China. “We look forward to exhibiting our solutions that are ideally suited to the types of sophisticated surface mount assembly applications of our customers in China. This will be the first time our Z-axis solution will be on display in China and we invite you to visit the booth for a personal demonstration. We look forward to meeting you at the show.”
For further information about Saki visit, visit www.sakicorp.com/en/.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.