Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
Saki to Exhibit Latest 3D-SPI and 3D-AOI System Solutions at NEPCON China 2021
April 7, 2021 | Saki CorporationEstimated reading time: 2 minutes
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting its latest 3D Solder Paste Inspection (SPI) and 3D Automatic Optical Inspection (AOI) systems on two booths at NEPCON China 2021. Visitors to the event are invited to interact with Saki equipment on the FUJI CORPORATION (FUJI) booth #1G60 and on the Shanghai Cent-Sun Electronic Co., Ltd. (CSE) Booth #1J25 where Saki will introduce its new innovative Z-axis optical-head control feature. The thirtieth NEPCON China exhibition will run from April 21 - 23 at the Shanghai World Expo Exhibition and Convention Center.
On booth #1J25, in collaboration with CSE, its China market distributor, Saki will show the large format 3Si-LD2 3D Solder Paste Inspection (SPI) system along with two models from its 3Di Series of AOI machines: the 3Di-LS2 and 3Di-LD2, which are the single-lane and dual-lane variants respectively of the company’s new large format 3D AOI machines. Saki’s 3Di Series AOI machines can all be fitted with the new Z-axis solution to achieve inspection of tall components, press-fit components and PCBAs in jigs. A maximum height-measurement range in 2D and 3D mode up to 40mm is made possible. Visitors to the CSE booth will experience a live demonstration of the newly developed Z-axis system.
The 3Di-LS2 and 3Di-LD2 platforms support board sizes up to 19.7 x 20.07 inches (500 x 510mm) and are available in three resolutions of 7?m, 12?m and 18?m. Saki L size AOI and SPI systems share many hardware and software characteristics designed to reduce running costs for customers.
On the FUJI booth #1G60, the compact Saki 3Di-MS2 AOI system will be featured in a special display area entitled ‘SiP and module board solutions’ within an SMT assembly line equipment configuration. As part of Saki’s 3Di Series, the 3Di-MS2 applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
“We are excited to be exhibiting with our China distribution partner CSE and collaborating with FUJI in its dedicated System in Package and module board solutions area,” says Zheng Ri, General Manager of Saki China. “We look forward to exhibiting our solutions that are ideally suited to the types of sophisticated surface mount assembly applications of our customers in China. This will be the first time our Z-axis solution will be on display in China and we invite you to visit the booth for a personal demonstration. We look forward to meeting you at the show.”
For further information about Saki visit, visit www.sakicorp.com/en/.
Share on:
Suggested Items
KYZEN to Highlight Stencil and Cleaning Solutions at SMTA Monterrey
03/27/2025 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, April 10 at the Cintermex Convention Center in Monterrey, Nuevo León. KYZEN cleaning experts will be on-site highlighting stencil cleaning chemistries KYZEN E5631J and CYBERSOLV C8882.
Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
03/26/2025 | Indium CorporationAs a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.
SolderKing Enhances Brainboxes' Electronics Manufacturing with Expert Support and Advanced Materials
03/26/2025 | SolderKingIn modern electronics manufacturing, success relies on more than high-quality soldering materials. Technical knowledge and process expertise are just as crucial for achieving consistent results. SolderKing, a leading UK manufacturer, provides both, combining advanced consumables with specialist support to help manufacturers optimise their soldering processes.
AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Monterrey Expo & Tech Forum
03/20/2025 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Monterrey Expo & Tech Forum taking place on April 10 at Cintermex in Monterrey, Nuevo Leon, Mexico.
Hentec Industries/RPS Automation to Showcase Valence 2508 at IPC Expo 2025
03/17/2025 | Hentec Industries/RPS AutomationThe Valence 2508 Selective Soldering System is engineered for high-mix, high-volume, advanced PCB production. It supports boards ranging from 25 x 25 mm to 559 x 559 mm (1 x 1 in. to 22 x 22 in.), with a maximum processing area of 508 x 508 mm (20 x 20 in.).