Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Koh Young America Service Deemed the Best In Its Segment
April 12, 2021 | Koh Young AmericaEstimated reading time: 3 minutes
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, humbly accepted its first 2021 Service Excellence Award on 06 April 2021 during a virtual awards ceremony. The program, now in its 29th year, is still an industry bellwether. It recognizes those companies dedicated to excelling in the crucial area of customer service.
“For years, I have praised our support team. I have always known they are head and shoulders above the others, and now I have objective proof,” commented Mr. Danny Han, Support Desk Manager and founding member of Koh Young America. “I always see our SPI, AOI, and software winning awards for their ability to save manufacturers time and money, but what about the people? I thought it was about time the customer service and support engineers at Koh Young America received the same recognition. I am thrilled that we finally participated in this prestigious competition. It’s our first entry and our first win – it doesn’t get much better,” cheered Mr. Han.
Manufacturers decide the Service Excellence award winners, so this award is incredibly special to Koh Young America. “Who better to judge our abilities than customers,” said Enrique Hernandez, Koh Young America Service Manager for Mexico. “Our customers push us improve and reach the zenith of customer service success. This feedback helps us improve operations and deliver new ways to support our customers,” concluded Mr. Hernandez.
There are few elements more important than equipment performance in a manufacturing environment. So, Koh Young wants to ensure our customers can effectively use our solutions to improve their production. Besides the Koh Young Demo, Application and Training Centers across North and South America, Koh
Young customers have access to a global network of service and support locations. You will have best-in-class support infrastructure at your disposal.
“During my tenure with a Tier 1 EMS (Electronics Manufacturing Service) provider, I had first-hand experience with the Koh Young service and support team as a customer. Fast forward, and now I am part of the same service and support team,” said Mr. David Nemeth, Koh Young America Service Manager for the United States and Canada. “I am proud of the team and this recognition it truly deserves.”
Driven by our innovative culture, Koh Young will continue to lead the inspection market with pioneering solutions, all the while helping our customers learn how to improve productivity and reduce costs with a better process using our innovations.
You can learn more about Koh Young America and its best-in-class inspection solution technologies and award- winning support team by visiting our new regional website at kohyoungamerica.com.
Be sure to visit I-007eBooks to download a copy of Koh Young's micro eBook 'The Printed Circuit Assembler's Guide to...SMT Inspection' today!
About Koh Young
Established in 2002, Koh Young pioneered the market by launching the first 3D Solder Paste Inspection (SPI) system using a patented dual-projection Moiré technology. Since then, it has become the global leader in 3D measurement- based SPI and Automated Optical Inspection (AOI) equipment for the electronics industry. Based on its True3D™ measurement-based inspection technology, Koh Young has developed new solutions for challenges with Machining Optical Inspection (MOI), Dispensing Process Inspection (DPI), and Semiconductor Packaging Inspection (MEISTER Series), as well as branching out to Medical Robotics for brain surgery (KYMERO). Through its technological innovations, Koh Young has secured thousands of global customers, and maintains the largest global market share in the SPI and AOI markets. Additionally, by adopting its user-centric R&D activities, it continues to leverage core competencies and develop innovative solutions for new and existing markets. Its activities stem from the corporate headquarters in Korea to its sales and support offices in Germany, Japan, Singapore, Vietnam, Penang, China, Brazil, Argentina, Canada, Mexico, and the United States. These local facilities ensure it keeps in close contact with the market, and more importantly, its growing customer base to provide access to an award-winning network of inspection and measurement experts. Learn why so many electronics manufacturers trust Koh Young for reliable inspection at kohyoung.com.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.