The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
MacDermid Alpha Launches ALPHA CVP-390V High Reliability Solder Paste for Harsh Operating Conditions
April 14, 2021 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces the release of ALPHA CVP-390V high reliability solder paste, designed to maximize flexibility in manufacturing and provide excellent electrochemical reliability in harsh operating conditions.
ALPHA CVP-390V is a next generation broad latitude chemistry that delivers consistent print and reflow performance across a wide range of component types and feature sizes. ALPHA CVP-390V exhibits best-in-class electrochemical reliability down to 0.100mm comb spacing against the most challenging automotive SIR profiles. The compatibility with the Innolot alloy and ability to maintain high electrochemical performance in harsh operating conditions on dense assembly designs makes ALPHA CVP-390V ideal for high reliability applications.
“ALPHA CVP-390V represents the continual evolution of our industry leading solder paste portfolio to ensure superior performance and reliability on complex PCB assemblies, comments Paul Salerno, Global Portfolio Manager, SMT at MacDermid Alpha. “Assemblies requiring flexibility across multiple component types and assemblies requiring fine feature printability and increased manufacturing throughput can also benefit from ALPHA CVP-390V.”
For more information on ALPHA CVP-390V solder paste please visit MacDermidAlpha.com.
About MacDermid Alpha Electronics Solutions:
Through the innovation of specialty chemicals and materials under our Alpha, Kester, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.