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BEST Inc. Publishes Optimizing BGA Rework Techniques to Ensure Quality Tech Paper

04/15/2026 | BEST Inc.
BEST Inc., a leader in electronic component and PCB services, is pleased to announce they have published a tech paper describing techniques for reworking BGA components to ensure quality during the printed circuit board rework process.

Beyond the Board: How a Diminished Supplier Base Affects Complex PCB Manufacturing Readiness in Defense

04/14/2026 | Jesse Vaughan -- Column: Beyond the Board
As mil/aero electronics push toward higher density, tighter tolerances, and more complex constructions, another trend has unfolded in parallel. It receives far less attention but carries equal consequence: A significant reduction in the number of fabricators that can support complex PCB manufacturing.

IPC CFX Demo Line Debuts in Korea at EMK 2026

04/10/2026 | Global Electronics Association
At Electronics Manufacturing Korea (EMK) x NEPCON Korea 2026, the Global Electronics Association, in collaboration with 13 companies, showcased the IPC CFX Demo Line (Connected Factory Exchange demonstration line), marking its debut in Korea.

BTU Appoints Performance Technologies Group as Exclusive Representative in Tri-State Region

04/08/2026 | BTU International, Inc.
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced that Performance Technologies Group, Inc. (PTG) has been appointed as its exclusive manufacturers’ representative for New York, New Jersey, and eastern Pennsylvania, effective March 20, 2026.

SEMI Reports Global Semiconductor Equipment Billings Reached $135 Billion in 2025, Up 15% YoY

04/08/2026 | SEMI
Worldwide sales of semiconductor manufacturing equipment increased 15% to $135.1 billion in 2025 from $117.1 billion in 2024, driven by continued investment in advanced logic, memory, and AI-related capacity expansion, SEMI, the industry association representing the global electronics design and manufacturing supply chain, reported.
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