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RTX to Develop Ultra-wide Bandgap Semiconductors for DARPA

10/03/2024 | RTX
Raytheon, an RTX business, has been awarded a three-year, two-phase contract from DARPA to develop foundational ultra-wide bandgap semiconductors, or UWBGS, based on diamond and aluminum nitride technology that revolutionize semiconductor electronics with increased power delivery and thermal management in sensors and other electronic applications.

Dymax to Showcase Expanding Range of Light-Cure Solutions for Electronics at SMTA International 2024

10/03/2024 | Dymax
Dymax, a leading manufacturer of light-curing materials and equipment, will exhibit at SMTA International 2024 in Rosemont, IL, from October 21-24.

Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024

10/02/2024 | SEMI
Powered by strong semiconductor demand across diverse end applications, the global semiconductor packaging materials market is expected to start a growth cycle with a 5.6% compound annual growth rate (CAGR) projected through 2028, SEMI, TECHCET and TechSearch International announced in their latest Global Semiconductor Packaging Materials Outlook (GSPMO) report.

Creative Materials Presents Reliable Solutions: 110-19(SD) and 129-50LS-2, Offering Alternatives to Legacy Materials

10/02/2024 | Creative Materials, Inc.
Creative Materials Inc., a leader in the development and manufacturing of advanced materials proudly announces the launch of two products,

Dana on Data: Resurrecting IPC Class 1

10/01/2024 | Dana Korf -- Column: Dana on Data
IPC specifications and guidelines have been the standard performance, quality, acceptance, and design basis for PCB designs for approximately two generations. They have proven to be conservative enough that PCBs far exceed their expected lifetimes in a multitude of environments. Requirements are continually adjusted to reflect improvements in materials and process capability that match the increasing component, interconnect, and cost reduction demands.
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