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A Better Way to Characterize Copper Foils for Flexible Printed Circuits, Advanced Packaging

08/13/2026 | Nolan Johnson, I-Connect007
Finite element analysis is only as accurate as the material properties behind it. Kenji Koike discusses research showing that digital image correlation produces more precise stress-strain curves and Young's modulus measurements for rolled copper foils, giving engineers greater confidence when designing flexible printed circuits and advanced packaging for demanding applications.

EIPC Summer Conference 2026: Technical Presentations Tell the Rest of the Story

08/12/2026 | Marcy LaRont, I-Connect007
In early June, the EIPC Summer Conference in Vilnius, Lithuania, featured an impressive group of speakers ranging from PCB suppliers and technical experts to startups and robotics OEMs, the latter of which added a “cool factor” to the meeting’s ambiance with a fully operational, interactive humanoid. After some early coverage of the event, I’m now following up with key takeaways from many of the technical presentations. I regret that I could not cover all speakers in detail, but this will give you a good taste of what you missed in Lithuania in June.

Trouble in Your Tank: At 40 GHz, Everything Matters, Part 2

07/27/2026 | Michael Carano -- Column: Trouble in Your Tank
In Part 1 of this article, we examined alternative solderable finishes for 5G/6G applications and reviewed literature on their performance at high frequencies. We found that certain solderable finishes are more susceptible to signal loss as frequency increases. These attenuation losses become increasingly significant at frequencies approaching and exceeding 40 GHz. Because of their high conductivity, silver and copper generally outperform finishes such as nickel and palladium. Taken together, these findings underscore the importance of finish selection in high-frequency applications.

Why Principal Mineral Bought Isola: The Vision Behind the Acquisition

07/16/2026 | Marcy LaRont, I-Connect007
With a mission focused on strengthening domestic capacity for strategic minerals and materials critical to national security, energy, AI, defense, and next-generation manufacturing, Principal Mineral is working to address some of the most urgent vulnerabilities in today’s supply chain. Its recent acquisition of Isola Group adds a major electronics materials platform to that portfolio. In this interview, Principal Mineral cofounders Adam Johnson, CEO, and Wes Spurlock, COO, discuss why Isola matters and what it will take to rebuild resilient U.S. supply chains at an industrial scale.

Fresh PCB Concepts: Engineering Copper Coin and Copper Pedestal Technology With IPC Design Interpretation

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Copper coin and copper pedestal technologies have become increasingly important in modern PCB design as thermal demands rise in power electronics, automotive systems, RF applications, aerospace electronics, and high-density computing environments. As component power density increases and board sizes shrink, traditional thermal management techniques often become insufficient to maintain acceptable operating temperatures and long-term reliability.
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