IPC Welcomes Yusaku Kono as New IPC Japan Representative
April 26, 2021 | IPCEstimated reading time: 1 minute
IPC announces the addition of Yusaku Kono as IPC’s Japan Representative. As IPC’s Japan Representative, Kono will lead the association’s efforts in expanding member outreach, standards development, education and advocacy support in Japan. He is based in Tokyo, Japan.
Kono specializes in marketing, branding, communication and strategic development. As Corporate Director of Japan Unix, Kono has collaborated with IPC since 2015, and has contributed a wide range of expertise and has worked to expand IPC standards development activities in Japan.
Kono won an IPC Rising Star award in 2018 and an IPC President’s award in 2021 for his extraordinary contributions of time, talent and ongoing leadership in IPC and the electronics industry.
“Japan is home to many top companies in the global electronics industry and is one of the most innovative countries in the world. As a global organization, IPC believes that it’s vital to collaborate with Japanese companies and government in shaping a better future of our industry,” said Sydney Xiao, President of IPC Asia Operations. “Yusaku deeply understands IPC’s values and mission in the industry. His knowledge and skills will help support IPC’s strategies and activities in Japan.”
Kono has a master’s degree in business administration from the Copenhagen Business School in Copenhagen, Denmark, a master’s degree in marketing strategy from Aston Business School in Birmingham, UK and a management engineering degree from Aoyamaga Gakuin University in Tokyo, Japan.
Suggested Items
ASC Sunstone Circuits and Screaming Circuits Hosts Successful Tech Summit, Setting New Standards in PCB Industry Collaboration
05/22/2024 | ASC SunstoneASC Sunstone Circuits (a division of American Standard Circuits), provider of high-quality printed circuit boards (PCBs) and Screaming Circuits (a division of Milwaukee Electronics), specialists of quick-turn prototype and on demand PCB assembly, successfully concluded its inaugural Tech Summit held at the Holiday Inn Columbia Riverfront April 25, 2024. The event brought together industry experts, innovators, and thought leaders to discuss emerging trends, share insights, and foster collaboration within the PCB community.
Advocacy: There’s No Time to Waste
05/21/2024 | Marcy LaRont, PCB007 MagazineIn the late 1990s, I worked for a PCB company ardently working to build manufacturing presences in Malaysia, Taiwan, and eventually China’s mainland. For some of us who had the resources, we followed our OEM customers offshore as they began demanding increasingly greater price concessions from their stateside suppliers. The government was not coming to the rescue of the PCB manufacturer, so we rode the changing economic tide as it turned unwaveringly toward globalism and cheaper labor.
Real Time with… IPC APEX EXPO 2024: Unveiling the New Chief Strategist of Advanced Packaging at IPC
05/21/2024 | Real Time with...IPC APEX EXPODevan Iyer, IPC's new chief strategist of advanced packaging, shares his industry experience and the objectives of his role and emphasizes the necessity for solid standards and guidelines for new packaging technologies and design methodologies. He also highlights the significance of diverse package technologies across different markets. Devan is looking forward to collaborating with IPC and industry members as they find ways to connect emerging package technologies with PCB/EMS systems.
TPCA Releases Guide to Help PCB Industry Achieve Low-Carbon Transformation
05/21/2024 | TPCAThe introduction of EU carbon tariffs, international brands committing to carbon neutrality, and the upcoming carbon fee in Taiwan means that carbon reduction is no longer just a slogan. Domestic and international pressures have turned carbon reduction into the golden grail of corporate sustainability.
SEMICON Europa 2024 Call for Abstracts Opens
05/21/2024 | SEMISEMI Europe announced the opening of the Call for Abstracts for SEMICON Europa 2024, to be held November 12-15 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), Fab Management Forum (FMF), MEMS & Imaging Sensors Summit and during presentations on the show floor.