Deutsche Aircraft Selects Honeywell to Provide High Frequency Radio System for the D328eco
November 21, 2024 | HoneywellEstimated reading time: 1 minute
Honeywell has been selected by Deutsche Aircraft, a German aircraft manufacturer, to supply its Primus HF-1050 high-frequency (HF) radio system for the recently debuted 40-seater D328eco turboprop. The HF-1050 is designed to deliver global voice communications, leveraging its unique features to enhance reliability and performance for operators worldwide. The selection of the HF-1050 supports Honeywell’s alignment of its portfolio to three compelling megatrends: automation, the future of aviation and energy transition.
As a high-frequency system, the HF-1050 enables seamless communication over vast distances with built-in technology that reduces background noise, ensuring clearer transmissions between pilots and air traffic controllers.
“We are delighted to continue our partnership with Deutsche Aircraft and support the D328eco program,” said Flavio Michio Osanai, EMEAI Vice President, Business & General Aviation Sales at Honeywell Aerospace Technologies. “Deutsche Aircraft’s selection of the HF-1050 underscores our commitment to the future of aviation and reinforces our focus on delivering reliable, cutting-edge avionics solutions that meet the evolving needs of our customers and their passengers.”
Honeywell avionics are already widely deployed on in-service D328® aircraft such as the Dornier 328-100 and Dornier 328-300. The selection of the HF-1050 builds on Honeywell’s longstanding relationship with Deutsche Aircraft and highlights its continued support for the Dornier fleet.
“We are pleased to partner with Honeywell to bring this proven communication technology to the D328eco,” said Patricia Ferrari, Vice President of Supply Chain at Deutsche Aircraft. “The HF-1050 system will offer operators a modernised aircraft that is equipped with reliable, long-range communication capabilities that will contribute to more efficient flights across the globe.”
Deutsche Aircraft plans to manufacture up to 48 D328eco aircraft per year at its state-of-the-art Final Assembly Line at Leipzig/Halle Airport. The D328eco aims to revolutionise regional aviation with an environmentally friendly and cost-effective platform. With its advanced technologies and sustainable design, the D328eco offers operators enhanced fuel efficiency and reduced emissions, contributing to a greener future for the aviation industry.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.