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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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IPC, ITI to Host Conference on Critical and Emerging Environmental Product Requirements
May 25, 2021 | IPCEstimated reading time: 2 minutes
IPC and the Information Technology Industry Council (ITI) will host a virtual conference, “Critical and Emerging Environmental Product Requirements” on June 29 from 11:00 am to 3:30 pm EDT. The event will explore the latest environmental requirements that impact product design, manufacturing, supply chain management, and technology innovation.
Speakers will include leading environmental regulatory experts Paul Tennant, Graeme Vickery and Hermione Mackelworth from the U.K. Department for Environment, Food and Rural Affairs (DEFRA), Madalina Laxton from the European Commission, Directorate-General for the Environment, and Joel Wolf from the ?U.S. Environmental Protection Agency (EPA).
Tennant and Vickery will provide an update on Brexit and possible environmental regulatory changes resulting from Brexit. Mackelworth will cover U.K. REACH. Laxton will address the latest policy developments on the EU’s RoHS Directive. Wolf will cover risk evaluations and risk management under the Toxic Substances Control Act (TSCA).
“New global environmental compliance requirements are emerging and existing requirements seem to be constantly evolving. To ensure adherence to environmental regulations, companies need to continually calibrate their compliance management functions,” said Kelly Scanlon, IPC director of environmental policy and research. “Misunderstanding these ever-changing requirements could have a disastrous impact for business. ITI and IPC’s virtual conference will provide the information compliance professionals and officers need to be up to date with legal, regulatory, and customer requirements.”
“From Brexit to a new administration in the U.S., recent changes to governments are having a real impact on environmental compliance regulations across the globe,” said Chris Cleet, ITI vice president of policy for environment, sustainability, and regulatory. “This conference will give companies a unique opportunity to hear directly from government officials and experts about the current policy landscape and provide critical information and resources compliance professionals need to effectively navigate new regulations and stay ahead of future changes.”
The event is sponsored by The Compliance Map, Benchmark ESG ? Gensuite, Total Parts Plus (TPP), and iPoint.
For detailed information on the agenda, speakers or to register for the “ITI and IPC Conference on Critical and Emerging Environmental Product Requirements,” visit https://www.ipc.org/environmental-conference-2021.
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Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.