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CyberOptics Receives New Order Valued at $1.3 Million for Mini LED Inspection and Metrology
May 25, 2021 | Business WireEstimated reading time: Less than a minute
CyberOptics Corporation, a leading global developer and manufacturer of high precision 3D sensing technology solutions, announced that it has received an order valued at approximately $1.3 million for a new customer adopting its SQ3000™ Multi-Function systems for mini LED inspection and metrology. Revenue from the order is expected to be recognized in the second half of 2021.
About CyberOptics
CyberOptics Corporation is a leading global developer and manufacturer of high-precision 3D sensing technology solutions. CyberOptics’ sensors are used for inspection and metrology in the SMT and semiconductor markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the Company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.
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Koh Young Highlighting 3D Inspection for Advanced Packaging at SEMICON Japan 2025 in Tokyo Big Sight
11/24/2025 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, will showcase its latest semiconductor inspection portfolio at SEMICON Japan 2025, held from December 17 to 19 at Tokyo Big Sight in Booth E5528.
Merlin PCB Group Invests in 2 CIMS Galaxy 25µ AOI Machines
11/13/2025 | Merlin PCB GroupThe Merlin PCB group has invested in CIMS Galaxy 25µ AOI machines, one for Merlin Flex in Hartlepool and the other for Merlin Circuit Technology in Hawarden.
GenI Generative AOI Programming Debuts: Mycronic Sets a New Standard in AOI Automation
11/10/2025 | MycronicMycronic’s PCB Assembly Solution division announces the launch of GenI™, an industry first solution designed to liberate electronics manufacturers from the complexities of traditional Automated Optical Inspection (AOI) programming.
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
Koh Young Technology Appoints Jeff Lee as Head of Industrial Solutions Business
11/03/2025 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, has appointed Jeff Lee as Head of Industrial Solutions Business.