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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Flexium Posts 7% YoY Growth in May 2021 Sales
June 7, 2021 | FlexiumEstimated reading time: Less than a minute
Taiwan-based flexible printed circuit (FPC) maker Flexium Interconnect Inc. has reported sales of NT$2.4 billion ($86.55 million at $1:NT$27.72 ) for May 2021, up by 7% compared to May last year, but almost flat from the previous month.
Total sales for the first five months of 2021 reached NT$11.9 billion ($430 million), up by 31.65% compared to the same period last year.
Suggested Items
Results of the AT&S Annual General Meeting: Andy Mattes appointed Chairman of the Supervisory Board
07/04/2025 | AT&SAndy Mattes was newly elected to the Supervisory Board of AT&S Austria Technologie und Systemtechnik Aktiengesellschaft and is appointed until the 36th Annual General Meeting 2030. Georg Hansis was re-elected.
Green Circuits to Exhibit Full-Service Electronics Manufacturing Solutions at 2025 SMD Symposium
07/02/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce its participation in the 2025 SMD Symposium, taking place August 5-7 at the Von Braun Center in Huntsville, Alabama.
Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
07/02/2025 | Barb Hockaday, I-Connect007In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (formerly DuPont Electronics), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.
High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
07/01/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
Zhen Ding's 2025 Lean & Digital Initiative Presentation Conference Concludes Successfully, Driving Group Transformation
07/01/2025 | Zhen DingTo advance its digital transformation strategy and embody the CA- PDCA continuous improvement philosophy, Zhen Ding Technology Group (Zhen Ding) successfully hosted the 2025 H1 Lean & Digital Initiative Presentation Conference.