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In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Flexium Posts 7% YoY Growth in May 2021 Sales
June 7, 2021 | FlexiumEstimated reading time: Less than a minute
Taiwan-based flexible printed circuit (FPC) maker Flexium Interconnect Inc. has reported sales of NT$2.4 billion ($86.55 million at $1:NT$27.72 ) for May 2021, up by 7% compared to May last year, but almost flat from the previous month.
Total sales for the first five months of 2021 reached NT$11.9 billion ($430 million), up by 31.65% compared to the same period last year.
Suggested Items
Merlin Circuit Technology Achieves Prestigious JOSCAR Accreditation
01/14/2025 | Merlin Circuit TechnologyMerlin Circuit Technology is proud to announce it has been awarded the coveted Joint Approvals Group for Industry (JAG) Standard 001 (JOSCAR) accreditation.
Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly
01/14/2025 | Happy Holden -- Column: Happy’s Tech TalkDr. Steven Case of Avanti Optics Corporation once advocated a new approach to photonic assembly, based on the LEGO principle. He compared today’s erbium-doped fiber amplifier (EDFA) technology to the crude point-to-point wiring of early model circuit boards, which gave way to modern circuit boards that could be considered prefabricated interconnects.
Expansion, Retirement, and New Leadership at FCT
01/09/2025 | Marcy LaRont, PCB007 MagazineIn the dynamic landscape of interconnect solutions, Flexible Circuit Technology (FCT) is making waves through significant leadership changes and expansion initiatives. Vice President Carey Burkett, newly appointed executive vice president Ray Cottrell, and marketing director Abby Meyer share their vision for steering the company toward innovative growth. FCT has a robust focus on diverse markets such as medical, automotive, consumer electronics, and HDI (high density interconnect). They are accelerating FCT’s mission to provide exceptional value and service to customers throughout the product lifecycle.
Flexible Thinking: Another PCB Design Paradigm Shift in the Works
01/09/2025 | Joe Fjelstad -- Column: Flexible ThinkingWe all read from the same technology scriptures and sing from the same design hymnals that serve the global congregation of printed circuit manufacturers and users, though there are still a few iconoclasts and heretics to challenge them in the service of largely positive change. Even subtle changes are hard to effect. People, especially those in manufacturing, do not like change because it disrupts the manufacturing floor routine. However, change, as even the ancient philosophers knew, is constant and required for continued growth and evolution.
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
01/07/2025 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.