Researchers Tame Silicon to Interact with Light for Next-generation Microelectronics
June 10, 2021 | SkoltechEstimated reading time: 2 minutes
Skoltech researchers and their colleagues from RAS Institute for Physics of Microstructures, Lobachevsky State University of Nizhny Novgorod, ITMO University, Lomonosov Moscow State University, and A.M. Prokhorov General Physics Institute have found a way to increase photoluminescence in silicon, the notoriously poor emitter and absorber of photons at the heart of all modern electronics. This discovery may pave the way to photonic integrated circuits, boosting their performance. The paper was published in the journal Laser and Photonics Reviews.
“Natural selection” in semiconductor technology over almost 80 years has led to silicon emerging as the predominant material for chips. Most digital microcircuits are created using CMOS technology (CMOS), which stands for complementary metal-oxide-semiconductor. Yet manufacturers have hit a wall on the way to increasing their performance even further: heat release due to high density of elements in CMOS circuits.
One potential workaround is reducing heat generation by switching from metallic connections between elements in microcircuits to optical ones: unlike electrons in conductors, photons can travel giant distances in wavegiudes with minimal heat losses.
“The transition to CMOS-compatible photonic integrated circuits will also make it possible to significantly increase the information transfer rate within a chip and between individual chips in modern computers, making them faster. Unfortunately, silicon itself weakly interacts with light: it is a poor emitter and a poor absorber of photons. Therefore, taming silicon to interact with light effectively is an essential task,” Sergey Dyakov, senior researcher at Skoltech and the first author of the paper, says.
Dyakov and his colleagues have managed to enhance silicon-based photoluminescence using germanium quantum dots and a specially designed photonic crystal. They used a resonator based on bound states in the continuum, an idea borrowed from quantum mechanics: these resonators create effective confinement of light inside them since the symmetry of the electromagnetic field inside the resonator does not correspond to the symmetry of the electromagnetic waves of the surrounding space.
They also chose germanium nanoislands as a source of luminescence, which can be embedded into the desired place on a silicon chip. “The use of bound states in the continuum increased luminescence intensity by more than a hundred times,” Dyakov says, noting that it can lead us to CMOS-compatible photonic integrated circuits.
“The results open up new possibilities for creating efficient radiation sources based on silicon, built into the circuits of modern microelectronics with optical signal processing. There are currently lots of groups working on creating light-emitting diodes based on such structures and the principles of their coupling with other elements on an optoelectronic chip,” Professor Nikolay Gippius, head of Nanophotonics Theory group at the Center of Photonics and Quantum Materials at Skoltech, says.
Read the original article, here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Interposers, Substrates, and Advanced Manufacturing
10/13/2025 | Marcy LaRont, I-Connect007I attend a lot of industry trade shows and conferences. Lately, during conversations with technologists, I’ve noticed that there is some confusion about what exactly constitutes an interposer. One question I hear every so often is, “Are all interposers substrates?” The short answer to that question is no. But some interposers are, in fact, full substrates.
Si2 Names NVIDIA, Synopsys Technologists to Lead New LLM Benchmarking Coalition
10/10/2025 | BUSINESS WIREThe Silicon Integration Initiative today announced the chair and vice chair of the Si2 Large Language Model Benchmarking Coalition (LBC), a collaborative industry initiative and standards body advancing AI for silicon design and verification that will expedite the development of high-quality large language models for semiconductor design problems.
Mercedes-Benz Shapes Future of Autonomous Computing as Co-Creator of Next-Generation Chip Standards with Athos Silicon
10/09/2025 | Mercedes-BenzMercedes-Benz announced a reference design collaboration with Athos Silicon, a specialized semiconductor company established by former engineers at Mercedes-Benz Research & Development North America, Inc. (MBRDNA).