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Advanced Electronics Packaging Digest

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Keysight Accelerates AttoTude IC Design Cycles by Over 50%

08/28/2026 | BUSINESS WIRE
Keysight Technologies, Inc. announced that AttoTude Inc., a pioneer of next-generation ASICs over Dielectric interconnect technology for AI and hyperscale data center applications, has expanded its use of Keysight EDA software to manage its full IC design workflow.

NHanced Semiconductors & University of Florida to Present on Advanced Packaging for Photonics at the 2026 SMTAI Conference

08/24/2026 | NHanced Semiconductors
The upcoming SMTA International Conference will feature a paper titled “Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration,” presented by NHanced Semiconductors vice-president Dr. Charles Woychik and Dr. Navid Asadizanjani from the Florida Semiconductor Institute at University of Florida.

NHanced Semiconductors, UF to Present Advanced Photonics Packaging at SMTAI 2026

08/18/2026 | PRNewswire
The upcoming SMTA International Conference will feature a paper titled “Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration,” presented by NHanced Semiconductors Vice President Dr. Charles Woychik and Dr. Navid Asadizanjani from the Florida Semiconductor Institute at University of Florida.

GlobalFoundries Reports Q2 2026 Revenue of $1.79B

08/11/2026 | GlobalFoundries
GLOBALFOUNDRIES Inc. (GF)  announced preliminary financial results for the second quarter ended June 30, 2026.

Sila Gets Conditional $1.4B U.S. Department of War Loan for Battery Manufacturing

08/10/2026 | BUSINESS WIRE
Sila, an advanced battery technology company, announced that it has received a conditional loan commitment of up to $1.4 billion from the United States Department of War through its Office of Strategic Capital (OSC).
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