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Flexible Circuit Technologies Expands with New Sr. Applications Engineer
June 24, 2021 | Flexible Circuit TechnologiesEstimated reading time: 1 minute
Flexible Circuit Technologies (FCT) is pleased to announce that Chris Clark has joined FCT as a Sr. Applications Engineer. Chris brings more than 30 years of experience in flex/rigid-flex design, design for manufacturability, process engineering, and fabrication. He also brings proven expertise in support of customers in providing responsive program management, communications, and customer care.
The breadth of his experience allows Chris to take a design from concept-to-creation by offering cost effective solutions while avoiding pitfalls along the way. Chris is also a member of the IPC2223, 6013, 4202, and 4204 committees. We are very pleased to have Chris Clark as part of our FCT team; his depth of expertise adds to our already impressive roster of highly experienced application engineers!
Carey Burkett, FCT vice president stated, "We are extremely pleased to be able to add Chris Clark as another high caliber industry expert to our staff. At FCT we are noted for providing our customers with the most experienced application engineering support. Our experts know the materials, material properties, what can and cannot be done, and offer years of design expertise which in turn helps us to provide our customers with cost effective solutions that will perform within challenging applications."
Flexible Circuit Technologies offers superior design expertise and is a premier provider of flexible circuits, rigid-flex, flexible heaters, membrane switches, plastic moldings, and value-added assembly, product module, and complete product box build services.
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I-Connect007 Survey Shows Rising Use of Flex and Rigid-Flex
07/24/2018 | I-Connect007 Research TeamIn our recent survey on flex and rigid-flex circuits, the majority of our respondents indicated an increase in their use of flex and rigid-flex technologies in their designs, indicating a continued shift in flex technology usage. We bring you the survey details here.