It’s Only Common Sense: Be the Solution, Not the Problem
American Made Advocacy: Long-time Challenges Confront a New Administration
Marcy's Musings: It's Show Time!
Maximilian Mohr Joins Altix as Their New DACH Regional Sales Director
July 1, 2021 | ALTIXEstimated reading time: 1 minute
Following the adoption of its extensive growth strategy, Altix is proud to announce the appointment of Maximilian Mohr as their new DACH Regional Sales Director. Starting early July, Mohr will be responsible for developing business development strategy, driving revenue as well as linking up with headquarters before registering and managing the subsidiary in the future. With immediate effect, Mohr will handle Germany and Switzerland directly while playing a more supportive role in the Austrian sales network.
Maximilian Mohr has worked ten years in mechanical engineering as a Sales Engineer representing companies throughout the world. He reveals his motivations following his new appointment: “I am thrilled to join a growing company that is investing so heavily in its expansion during these difficult times. I look forward to expand our customer base in the region by proposing our wide range of imaging systems to various sectors such as the PCB, FPC, Photo Chemical Milling and Touch Panels industries.”
Frédéric Baradel, Altix Vice-President, comments: “After a fruitful 18-year-long collaboration with our agent ExCellTec, we decided it was time to expand our internal structure to be closer to our clients. We are very thankful to have had such resourceful and dedicated partners for almost two decades and look forward to welcome Maximilian Mohr to our team.”
Share on:
Suggested Items
Aismalibar to Showcase Advanced Thermal Management Solutions at APEC 2025
03/13/2025 | AismalibarAismalibar, a global leader in high-performance thermal management materials, is set to exhibit at APEC 2025 (Applied Power Electronics Conference) in Atlanta, Georgia, from March 16–20, 2025. As the premier event for power electronics professionals, APEC provides a crucial platform for industry leaders to explore the latest advancements in thermal interface materials (TIMs), high-performance PCB laminates, and insulated metal substrates (IMS).
Technica USA Celebrates 40 Years of Excellence in Electronics Manufacturing
03/13/2025 | Technica USATechnica USA, a leading provider of materials, equipment, installation, and services for the printed circuit board (PCB) fabrication, PCB Assembly, substrates, MEMS, and semiconductor industries, proudly announces its 40th anniversary in 2025.
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
03/13/2025 | John Watson -- Column: Elementary, Mr. WatsonAt the 2020 Tokyo Summer Olympics, the U.S. men's 4x100-meter relay team had high hopes of winning a medal. The team comprised some of the fastest sprinters in the world, but something went wrong. In a relay, four runners must smoothly pass their baton to the next runner inside a zone on the track. If a runner drops the baton or it’s passed outside the zone, the team risks disqualification. The U.S. team’s pass between the second and third runner was messy, slowing them down. By the time the last runner received the baton, the team had lost too much time. They finished sixth in their heat and didn’t qualify for the final.
MicroCraft to Unveil Three New Models at IPC APEX EXPO 2025
03/12/2025 | MicroCraftMicroCraft, a global leader in PCB testing and precision inkjet printing solutions, is set to showcase three cutting-edge models at IPC APEX EXPO 2025 at the Anaheim Convention Center March 18-20 in booth #4105. Each model represents the latest advancements in speed, accuracy, and automation across MicroCraft’s three product lines.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.