Camtek Secures $10M Order from Leading CMOS Image Sensor Manufacturer
July 5, 2021 | PRNewswireEstimated reading time: Less than a minute

Camtek Ltd. announced that it received a multiple systems order from a leading CMOS Image Sensor (CIS) manufacturer totaling $10 million.
The higher resolution and smaller pixel size of the sensor area make an inspection of CMOS Image Sensors very challenging. Camtek's latest model, EagleT+, is equipped with cutting-edge technologies to address the complex production processes of CMOS Image Sensors.
The systems are expected to be delivered in the fourth quarter of 2021 and the first quarter of 2022.
Rafi Amit, Chief Executive Officer, commented, "We are very pleased with our positive momentum throughout 2021 and our sales to the CMOS Image Sensors market, which keeps its solid growth trajectory. As the leading supplier of inspection and metrology systems, we are well-positioned to capitalize on the ongoing trends.
Suggested Items
Self-Healing Materials Could Unlock the Potential of Tomorrow’s Technology, Reports IDTechEx
05/22/2025 | IDTechExA sci-fi movie trope is the virtually indestructible robot, capable of operating without rest due to extended battery life, able to interact with its surroundings like a human thanks to advanced soft robotic components, and fully autonomous due to an extensive suite of sensors.
Interlink Electronics Reports Q1 2025 Result
05/15/2025 | BUSINESS WIREInterlink Electronics, Inc., a global leader in sensor technology and printed electronic solutions, reported results for the first quarter ended March 31, 2025.
Kitron Signs €7 Million Annual Manufacturing Agreement for Advanced Sensor Technology
05/09/2025 | KitronKitron has entered into a multi-year agreement with a U.S.-based customer to manufacture advanced sensor-based products intended for the European market.
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
05/05/2025 | SEMISEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.
UHDI Fundamentals: UHDI Drives Unique IoT Innovation in Farming
04/22/2025 | Anaya Vardya, American Standard CircuitsThe combination of UHDI's high-bandwidth capabilities and IoT's real-time data processing can lead to more efficient, immersive, and smarter IoT systems. This convergence of two revolutionary technologies is enabling quantum advancements in some very “unconventional” applications. The typical discussions around UHDI focus on our standard electronics industry market segments like milaero, medical, consumer electronics, etc. IoT is all about machines talking to other machines, machine learning, and artificial intelligence, but again, typically applied in our PCB and assembly operations.