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EIPC to Hold Technical Snapshot Webinar
July 7, 2021 | EIPCEstimated reading time: 1 minute
Events over the past 18 months have necessitated a change in the way we think. No longer can we go about our daily business in the manner we had become accustomed to. Things we took for granted had gone; things we had never even imagined now needed to be considered carefully. The need for mental agility and inventiveness has never been stronger.
The European Institute for the PCB Community (EIPC) is no different from anyone else who wished to communicate—at a distance. What we had perhaps not appreciated was the enthusiasm with which this new approach was embraced, and this has led to a succession of very popular webinars. On July 14, EIPC will be holding its 10th webinar.
There will be two sessions: in the first, Dr. Shiuh-Kao Chiang of Prismark will provide an update on the PCB market and the outlook for the future. Meanwhile, along the lines of thinking differently, Jani Rusi will provide some tips for networking in a post-COVID world. The What, the How, and the Why.
Rusi represents 204.5cm of expertise from Turku in Finland. He is the COO of World Trade Centre Turku, a serial entrepreneur, and a strongly networked professional focusing on business matchmaking—a “business pimp” as he was named after one event. A retired professional swimmer, a start-up-guy with two unsuccessful exits and several coaching cases, Rusi is an inspiring speaker with lots of experience where he finds the best stories and examples to share with the audience. After the two sessions, there will be a Q&A panel at 16:00 hrs.
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Aismalibar to Showcase Advanced Thermal Management Solutions at APEC 2025
03/13/2025 | AismalibarAismalibar, a global leader in high-performance thermal management materials, is set to exhibit at APEC 2025 (Applied Power Electronics Conference) in Atlanta, Georgia, from March 16–20, 2025. As the premier event for power electronics professionals, APEC provides a crucial platform for industry leaders to explore the latest advancements in thermal interface materials (TIMs), high-performance PCB laminates, and insulated metal substrates (IMS).
Technica USA Celebrates 40 Years of Excellence in Electronics Manufacturing
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Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
03/13/2025 | John Watson -- Column: Elementary, Mr. WatsonAt the 2020 Tokyo Summer Olympics, the U.S. men's 4x100-meter relay team had high hopes of winning a medal. The team comprised some of the fastest sprinters in the world, but something went wrong. In a relay, four runners must smoothly pass their baton to the next runner inside a zone on the track. If a runner drops the baton or it’s passed outside the zone, the team risks disqualification. The U.S. team’s pass between the second and third runner was messy, slowing them down. By the time the last runner received the baton, the team had lost too much time. They finished sixth in their heat and didn’t qualify for the final.
MicroCraft to Unveil Three New Models at IPC APEX EXPO 2025
03/12/2025 | MicroCraftMicroCraft, a global leader in PCB testing and precision inkjet printing solutions, is set to showcase three cutting-edge models at IPC APEX EXPO 2025 at the Anaheim Convention Center March 18-20 in booth #4105. Each model represents the latest advancements in speed, accuracy, and automation across MicroCraft’s three product lines.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.