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BTU to Show Selective Soldering, Vacuum Reflow at NEPCON South China
July 26, 2021 | BTU International, Inc.Estimated reading time: Less than a minute
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced plans to exhibit at NEPCON South China, scheduled to take place Aug. 25-27, 2021 at the Shenzhen International Convention & Exhibition Center, booth number 1P45. BTU will showcase the new Valence 3508 selective soldering system and PYRAMAX™ Vacuum Reflow Oven.
The Valence 3508 was designed for high mix, high volume, high-level PCB production. The continuous duty, multi-station, in-line selective soldering machine utilizes an electromagnetic pump. The Valence 3508 can be programmed in minutes and is highly configurable and customizable. With a three-shift processing area and stainless-steel ball screws, the Valence 3508 selective soldering system increases production efficiency and reduces downtime associated with maintenance.
The PYRAMAX Vacuum reflow oven has been designed to meet the solder voiding requirements and high-volume demands of electronics assembly and semiconductor packaging applications. The unit is configured with 10 zones of closed-loop convection heating, two zones of convection vacuum chamber heat assist and an internal vacuum chamber heater for precise profile control. The vacuum chamber can accommodate a maximum product size of 18” by 18”. Nitrogen atmosphere capable, the PYRAMAX Vacuum reflow oven offers a maximum process temperature of 350° C.
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