The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Silicon Wafer Shipments Reach New High in Q2 2021
July 29, 2021 | SEMIEstimated reading time: Less than a minute
Worldwide silicon wafer area shipments increased 6% to 3,534 million square inches in the second quarter of 2021, surpassing the historical high set in the first quarter, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry. Second quarter 2021 silicon wafer shipments grew 12% from the 3,152 million square inches recorded during the same quarter last year.
“Demand for silicon continues to see strong growth driven by multiple end-applications,” said Neil Weaver, chairman SEMI SMG and Vice President, Product Development and Applications Engineering at Shin Etsu Handotai America. “The supply of silicon for both 300mm and 200mm applications is tightening as demand continues to outstrip supply.”
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Interposers, Substrates, and Advanced Manufacturing
10/13/2025 | Marcy LaRont, I-Connect007I attend a lot of industry trade shows and conferences. Lately, during conversations with technologists, I’ve noticed that there is some confusion about what exactly constitutes an interposer. One question I hear every so often is, “Are all interposers substrates?” The short answer to that question is no. But some interposers are, in fact, full substrates.
Si2 Names NVIDIA, Synopsys Technologists to Lead New LLM Benchmarking Coalition
10/10/2025 | BUSINESS WIREThe Silicon Integration Initiative today announced the chair and vice chair of the Si2 Large Language Model Benchmarking Coalition (LBC), a collaborative industry initiative and standards body advancing AI for silicon design and verification that will expedite the development of high-quality large language models for semiconductor design problems.
Mercedes-Benz Shapes Future of Autonomous Computing as Co-Creator of Next-Generation Chip Standards with Athos Silicon
10/09/2025 | Mercedes-BenzMercedes-Benz announced a reference design collaboration with Athos Silicon, a specialized semiconductor company established by former engineers at Mercedes-Benz Research & Development North America, Inc. (MBRDNA).