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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Jon Peddie Research Releases New Photonic AI Processors Report

04/07/2026 | Jon Peddie Research
Jon Peddie Research (JPR), the leading research and consulting firm for graphics and AI technologies, has released its latest report on AI, the Photonic AI Processors report covering developments during the third quarter of 2025.

Trio-Tech Wins $5.3M Order for AI GPU Boards

03/17/2026 | BUSINESS WIRE
Trio-Tech International, a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced it has received orders valued at approximately $5.3 million to supply high-performance Burn-In Boards (BIBs).

Empower Launches High-Density Embedded Silicon Capacitors for AI and HPC

02/11/2026 | Empower Semiconductor
Empower Semiconductor, the world leader in powering artificial intelligence (AI)-class processors, today announced the launch of three new embedded silicon capacitors (ECAPs™), designed to meet the power integrity demands of next-generation AI and high-performance computing (HPC) processors.

Origin℠ AI, NXP Team Up to Accelerate Embedded WiFi Sensing for the Smart Home

01/15/2026 | PRNewswire
This endeavor fast-tracks the deployment of intelligent motion sensing into smart home devices, opening the door for powerful new services across home automation, security and energy management.

Gartner: Worldwide Semiconductor Revenue Grew 21% in 2025

01/12/2026 | Gartner, Inc.
Worldwide semiconductor revenue totaled $793 billion in 2025, an increase of 21% year-over-year (YoY), according to preliminary results by Gartner, Inc., a business and technology insights company.
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