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A University Model for Training the Next Generation of PCB Designers

08/19/2026 | Marcy LaRont, I-Connect007
Veteran PCB designer and educator John Watson has building one of the nation's most comprehensive university-based PCB design certificate programs in the country. He’s working with Palomar College, UC San Diego, UC Santa Cruz, and UMass Lowell to teach the complete design-to-manufacturing process while connecting students with internships and career opportunities. I spoke with John about the industry's workforce challenges, building meaningful educational pathways, and why the next generation of PCB designers may come from places few would expect.

PCB West Panel to Take On What’s Next for PCB Design

08/19/2026 | PCEA
The Printed Circuit Engineering Association (PCEA) has announced a panel discussion on the technologies reshaping printed circuit board design over the next two to five years will take place at PCB West 2026.

Eltek Reports Q2 2026 Results

08/19/2026 | Eltek
 Eltek Ltd., a leading global manufacturer of high-quality printed circuit boards, announced its financial results for the quarter ended June 30, 2026.

August I-Connect007 Magazine: The Electronics Ecosystem From Design to Development

08/18/2026 | I-Connect007 Editorial Team
This issue of I-Connect007 Magazine examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products. Our contributors explore co-design from multiple perspectives, using analogies from the forest to the Olympics. We also revisit VeCS for high layer count HDI PCB fabrication, plating challenges for advanced packaging, new applications for flex circuits in robots, and how the U.S. national defense policy could affect PCB sourcing.

Zhen Ding, NTHU Showcase Smart Manufacturing R&D at IEEE Conference

08/17/2026 | Zhen Ding
Zhen Ding Technology Holding Limited, a global PCB industry leader, and National Tsing Hua University (NTHU) have achieved significant results through their industry-academia collaboration, with five smart manufacturing research papers selected for presentation at the 22nd IEEE International Conference on Automation Science and Engineering (IEEE CASE 2026), held August 17-21 in Shenyang, China.
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