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Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper

05/09/2025 | Michael Carano -- Column: Trouble in Your Tank
In the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.

Real Time with... IPC APEX EXPO 2025: Uyemura—Inside the Specialty Chemicals Market

04/03/2025 | Real Time with...IPC APEX EXPO
Rich Depoto discusses Uyemura's focus on specialty chemicals and market trends, particularly the shift towards HDI and UHDI products. Rich highlights innovations in surface adhesion and micro etches for copper, essential for high-speed transmission.

Uyemura Announces Six Sigma Graduates

04/02/2025 | Uyemura
Dr. Patrick Valentine, Technical & Lean Six Sigma Manager and Six Sigma Master Black Belt, announces the completion of Lean Six Sigma Black Belt training by 4 members of Uyemura’s professional staff.

Gold as a Key Component in PCBs and IC Substrates

03/20/2025 | Britta Schafsteller, Sandra Nelle, and Kuldip Johal, MKS' Atotech
Gold has long been a cornerstone in the electronics industry, particularly in the surface finishing of PCBs and IC substrates. It provides essential surface protection while enabling various assembling techniques, such as soldering connections and wire bonding, using aluminum, gold, or copper wires.

SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition

12/16/2024 | SCHMID Group
The SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.
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