ASUS Introduces the Build Together, Give Together Charity Challenge
August 26, 2021 | Business WireEstimated reading time: 1 minute
ASUS has announced the Build Together, Give Together charity challenge, inviting PC builders, gamers and modders to build for a cause starting on August 24. In celebration of the growing PC building community, the Build Together, Give Together challenge encourages aspiring builders and tech enthusiasts alike to share their PC build and donate to their favorite charity. To contribute to the donations made by the PC building community, ASUS will also be creating high-end PC builds to auction as well as donating directly to charities, including Make-A-Wish® Greater Bay Area, Gamers Outreach, and Child’s Play, with the help of longtime industry partners including AMD, Intel and NVIDIA as well as Best Buy Canada, Canada Computers, D&H Distributing, Digital Storm, Memory Express, Micro Center and Newegg.
“For many of us at ASUS, PC building is more than just a hobby – it’s a way to make new friends, bond with our loved ones, and connect with a global community of builders and tech enthusiasts,” said Jackie Hsu, ASUS Senior Vice President and Co-Head of the Open Platform Business Group and AIoT Business Group. “To celebrate our community and the ways PC building brings us together, we’re proud to launch the Build Together, Give Together challenge alongside our closest partners to spread the joys of PC building in light of these wonderful causes.”
Join ASUS for the Build Together, Give Together Charity Challenge
To kick off the Build Together, Give Together challenge, ASUS Senior Vice President Jackie Hsu, President of ASMedia Technologies Inc. at ASUS Group Chewei Lin, and ASUS Chief Operating Officer Joe Hsieh is challenging partners and PC builders of all skill levels to join in by uploading their own PC building video using the hashtags #BuildTogether and #GiveTogether.
Suggested Items
Real Time with… IPC APEX EXPO 2024: The Success and Future of IPS's Vertical Technology
05/13/2024 | Real Time with...IPC APEX EXPOMike Brask reports on his experience at the show, telling us about the buzz surrounding the vertical technology offerings at IPS, and its benefits. He highlights their customer-centric approach, future growth strategies, and the challenges in workforce management. The conversation also touches upon their recruitment strategies and expresses optimism for the industry's future.
Real Time with… IPC APEX EXPO 2024: Dedication to Innovation and Reliability
05/10/2024 | Real Time with...IPC APEX EXPOGarrett Harding of MicroCraft outlines the company's history, product lines, and his personal journey. The discussion revolves around the adoption and benefits of inkjet printing, MicroCraft's ink solutions, and test equipment. Garrett also addresses the challenges in persuading OEMs and the current adoption rate, underscoring MicroCraft's dedication to innovation and reliability.
EMA Webinar: Next Generation MCAD/ECAD for SOLIDWORKS
05/09/2024 | EMA Design AutomationLearn how the MCAD and ECAD experts at Hawk Ridge and EMA can help you solve your MCAD/ECAD integration challenges with this unique collaboration environment.
Future Innovators Challenged by UK Robotics Leaders to Design Nuclear Fission and Fusion Decommissioning Robots
05/09/2024 | RAICoStudents in West Cumbria have been tasked by the Robotics and AI Collaboration (RAICo) and the Industrial Solutions Hub (iSH) to design and build robots which will be showcased at a major robotics and artificial intelligence (RAI) industry event.
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.