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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

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Suggested Items

New Episode Drop: MKS’ ESI’s Role in Optimize the Interconnect

08/21/2025 | I-Connect007
In this latest episode, Casey Kruger, director of product marketing at MKS’ ESI, joins On the Line With… host Nolan Johnson to share how CO₂ laser technology delivers faster, more accurate vias in a smaller, more energy-efficient footprint.

SEL: Revolutionizing PCB Production Through MES, Partnerships, and Vision

08/21/2025 | Barry Matties, I-Connect007
Two years ago, we visited Schweitzer Engineering Laboratories (SEL) to better understand its new captive greenfield PCB facility. We recently returned, this time to discuss how this bold vision has transformed the industry. Barry Matties met with John Hendrickson, engineering director, and Jessi Hall, vice president of vertical integration, to discuss the transformative capabilities of Factory Core, SEL’s custom manufacturing execution system (MES), which allows for real-time monitoring of workflow and machine performance, and has led to impressive improvements in quality and cost efficiency.

MKS’ Atotech to Participate in IPCA Electronics Expo 2025

08/11/2025 | Atotech
MKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands ESI® (laser systems) and Atotech® (process chemicals, equipment, software, and services) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 17th IPCA Show to be held at Pragati Maidan, New Delhi from August 21-23, 2025.

MKS Showcases Next-generation PCB Manufacturing Solutions at the Thailand Electronics Circuit Asia 2025

08/06/2025 | MKS Instruments, Inc.
MKS Inc, a global provider of enabling technologies that transform our world, today announced its participation in Thailand Electronics Circuit Asia 2025 (THECA 2025), taking place August 20–22 at BITEC in Bangkok.

Advancing Electrolytic Copper Plating for AI-driven Package Substrates

08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ Atotech
The rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.
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