-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Flex Receives Third Consecutive European Lenovo Logistics Excellence Award
September 21, 2021 | FlexEstimated reading time: 1 minute
Flex announced it is the winner of the European Lenovo Logistics Excellence Award, its third consecutive award in this category. The award was presented to Flex at the recent Lenovo Global Logistics Suppliers Conference FY21/22 in recognition of sustained high performance and flexibility despite growing complexity and significant increases in volumes.
Flex supports Lenovo PC & Smart Devices, Mobile and Data Center business groups and offers a number of supply chain management services including ocean and rail transport, inventory management, and logistics support.
Flex also manages Lenovo repairs, parts and last mile distribution to Lenovo customers in Europe.
Speaking at the virtual Lenovo Supplier Conference, Lenovo Logistics Director EMEA, Dick van Beek said, “In what was an extraordinary year for logistics, Flex delivered outstanding support to the Lenovo EMEA Region. As more people worked from home, we saw increased demand for our products combined with increased complexity in getting those products to customers. Flex adapted without missing a beat, and are deserving winners of the Logistics Excellence Award.”
Commenting on the award, Pat Ring, Senior Vice President and General Manager for Flex Global Services and Solutions said, “We are truly honored to receive this award for the third consecutive year and I am very proud of the commitment and motivation by our team in a highly volatile and dynamic environment. Collaboration, communication and trust are the characteristics that enabled us to maintain high levels of service delivery despite the many challenges of the last year.”
Suggested Items
Flexible Electronics Market to Reach $66.9 Billion by 2032, Growing at a CAGR of 9.2% from 2025
06/30/2025 | PRNewswireThe flexible electronics market is projected to reach $66.9 billion by 2032, up from an estimated $38.4 billion in 2025, growing at a robust CAGR of 9.2% during the forecast period.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
Gorilla Circuits Elevates PCB Precision with Schmoll’s Optiflex II Alignment System
06/23/2025 | Schmoll MaschinenGorilla Circuits, a leading PCB manufacturer based in Silicon Valley, has enhanced its production capabilities with the addition of Schmoll Maschinen’s Optiflex II Post-Etch Punch system—bringing a new level of precision to multilayer board fabrication.
All Flex Solutions Upgrades Lamination Layup
06/22/2025 | All Flex SolutionsAll Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.
SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
06/18/2025 | SEMIFlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing.