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October 6, 2021 | Kobi Levi, Siemens Digital Industries Software, Sponsored ContentEstimated reading time: 9 minutes
Before the process plan is released to the shop floor for execution, the process engineer must validate that the assembly has been implemented correctly. A sticky tape analysis is performed in which the production line is used to place the components physically on sticky tape. This occupies the production line and halts production.
A digitalized solution enables a virtual sticky tape analysis that digitalizes the entire validation process. Performing the analysis on a digital twin is much faster, does not require any physical assets, and the production line can continue production while performing the analysis. The analysis can be done anywhere, even from home or on another continent.
Inspections and Testing
Quality and test engineers must ensure that the process supports the production of PCB assemblies with the required quality by using a set of inspections and tests conducted during the production process. These include solder paste inspection (SPI), automated optical inspections (AOI), automated X-ray inspections (AXI), manual inspections, and in-circuit-tests (ICT). A digitalized solution supports the full digitalization of test and inspection definition. Eventually, it produces the machine files and the manual work instructions to perform these tests automatically, as part of the route.
Release the Route
Releasing Production to the Shop Floor
After the planning and validation work is completed, the process engineer releases the work to the shop floor. This is typically done via email and/or by uploading files to the company’s network. These methods of data delivery are susceptible to error, as both the process engineer and the shop floor manager can send or use the wrong production plan on the shop floor. They also pose a security risk as the production plan can be accessed by unauthorized people in the organization.
A digitalized solution, integrated with the PLM system, enables an automatic and controlled release to the shop floor.
Applying Lean Manufacturing Standards in Your Organization
Valor Process Preparation is a fully digitalized solution that addresses all the challenges discussed in this article. Integrated with Teamcenter, Siemens’ PLM solution, Process Preparation can fully digitalize the process, from the receipt of the design data from the PCB designer to the completion of the process engineering when all machine files and work instructions are sent to the shop floor.
Whether you are an OEM or an EMS digitalizing your manufacturing and applying the digital twin concept, Process Preparation can help you make manufacturing and design decisions early in the manufacturing process and reach production with confidence in the design and process planning. This leads to leaner and more efficient production and improves competitiveness, through improved cost, faster time to market, and higher resource utilization.
Kobi Levi is the business development manager for Siemens Digital Industries Software.
SPONSORED LINKS
White Paper - PCB Assembly Process - Benefits of Using Digital Twin Software
White Paper - Portability is Key to Competitiveness for PCB Manufacturers
Free Trial - Test Drive Valor Process Preparation for 30 Days
Ebook Download - The Printed Circuit Assembler's Guide to...Smart Data
I-007e Micro Webinar Series - Implementing "Digital Twin" Best Practices From Design Through Manufacturing
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