Showa Denko Concludes Long-Term Contract to Supply SiC Epitaxial Wafers for Toshiba
September 30, 2021 | ACN NewswireEstimated reading time: 1 minute

Showa Denko K.K. concluded a long-term supply contract with Toshiba Electronic Devices & Storage Corporation (Toshiba), a Japanese electronic device manufacturer providing highly efficient SiC-power-semiconductor based power devices for the global market, to supply SiC epitaxial wafers for power semiconductors (SiC epi-wafers) for two and a half years with an optional extension clause.
Toshiba has been developing and commercializing various kinds of SiC-based power devices including inverters for railcars, while adopting SiC epi-wafers manufactured by SDK as main material for SiC-based schottky barrier diode (SiC SBD) and SiC-based metal-oxide-semiconductor field-effect transistor (SiC MOSFET).
Toshiba decided to conclude this long-term contract because the company appreciated homogeneity in properties and low density of surface defects of SiC epi-wafers manufactured by SDK. This long-term contract will further strengthen technical cooperation between SDK and Toshiba on improvement in performance of SiC epi-wafers. In addition, SDK expects that Toshiba's adoption of SiC epi-wafers manufactured by SDK will help SDK to expand its SiC epi-wafer business further.
As the largest independent manufacturer of SiC epi-wafers (estimated by SDK), and under a motto of "Best in Class," the Showa Denko Group will continue coping with rapid expansion of the market for SiC epi-wafers and providing the market with high-performance and highly-reliable products, thereby contributing to the propagation of SiC power semiconductors which save energy with small power loss and less heat generation.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
SK keyfoundry, in Collaboration with LB Semicon, Co-Develops Direct RDL to Advance Semiconductor Packaging
07/21/2025 | SK keyfoundrySK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor packaging technology based on 8-inch wafers – in collaboration with LB Semicon.
Fraunhofer IPMS, DIVE Optimize Semiconductor Processes with Cutting-Edge Measurement System
07/17/2025 | Fraunhofer IPMSThe Fraunhofer Institute for Photonic Microsystems IPMS, in collaboration with DIVE imaging systems GmbH, has achieved a major milestone in resource-efficient semiconductor manufacturing.
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
3Q25 NAND Flash Contract Prices Projected to Rise 5–10%; Weak Smartphone Demand Limits eMMC and UFS Growth
07/09/2025 | TrendForceTrendForce’s latest investigations find that the NAND Flash market has seen significant improvement in supply-demand balance following production cuts and inventory reduction in the first half of 2025.
SEMI, Linx Consulting Unveil Wafer Fab Materials Quarterly Report
07/07/2025 | SEMISEMI, the global industry association advancing the electronics manufacturing and design supply chain, launched the new Wafer Fab Materials Quarterly report in collaboration with Linx Consulting.