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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Winonics Invests $3.9M in Equipment for Lean Six Sigma Renovation
September 30, 2021 | WinonicsEstimated reading time: 1 minute
Winonics Brea, an Additive Circuits Technologies, LLC company, is pleased to announce its “Facility Master Plan.”
Winonics has set out to differentiate itself by investing approximately $3.9 million in to a facility-wide renovation plan that includes extensive equipment and technology upgrades along with infrastructure improvements that are grounded in the principles of lean manufacturing and lean six sigma disciplines.
The Facility Master Plan offers a vision into advanced technology PCB fabrication with the expectations of creating a world-class PCB manufacturing facility and a research and development center for the company’s patented additive manufacturing technology.
“We are investing in our four pillars; equipment and technology, people, process, and methodology,” said David Torp, Winonics’ CEO. “When fully executed the plan is transformative and will set a new standard for PCB manufacturing; placing Winonics among the top advanced technology providers in the country.”
The plan, which will support Winonics’ strategic plan priorities and facilitate the commercialization of the company’s additive manufacturing technology, is expected to be completed in the first quarter of 2022.
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