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Winonics Invests $3.9M in Equipment for Lean Six Sigma Renovation
September 30, 2021 | WinonicsEstimated reading time: Less than a minute
Winonics Brea, an Additive Circuits Technologies, LLC company, is pleased to announce its “Facility Master Plan.”
Winonics has set out to differentiate itself by investing approximately $3.9 million in to a facility-wide renovation plan that includes extensive equipment and technology upgrades along with infrastructure improvements that are grounded in the principles of lean manufacturing and lean six sigma disciplines.
The Facility Master Plan offers a vision into advanced technology PCB fabrication with the expectations of creating a world-class PCB manufacturing facility and a research and development center for the company’s patented additive manufacturing technology.
“We are investing in our four pillars; equipment and technology, people, process, and methodology,” said David Torp, Winonics’ CEO. “When fully executed the plan is transformative and will set a new standard for PCB manufacturing; placing Winonics among the top advanced technology providers in the country.”
The plan, which will support Winonics’ strategic plan priorities and facilitate the commercialization of the company’s additive manufacturing technology, is expected to be completed in the first quarter of 2022.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/29/2025 | Nolan Johnson, I-Connect007This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.
ICZOOM Launches PCB & SMT Services to Strengthen One-Stop Electronics Industry Solution at IIC Shenzhen 2025
08/28/2025 | PRNewswireICZOOM Group Inc., a B2B electronic component products e-commerce platform, successfully exhibited at the 2025 International Integrated Circuit & Component Exhibition and Conference (IIC Shenzhen 2025) held from August 26 to 28 at the Shenzhen Convention & Exhibition Center in Futian District.
AT&S Fuels Future Innovation with 'Young Wilds' Program
08/28/2025 | AT&SToday’s ideas are tomorrow’s innovations: Following a successful debut in the financial year 2024/25, the “Young Wilds” program offers ambitious young professionals at AT&S the opportunity to take on responsibility and accelerate their personal and professional growth.
North American PCB Industry Shipments Up 20.7 Percent in July
08/27/2025 | Global Electronics AssociationThe Global Electronics Association announced today the July 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.00. Total North American PCB shipments in July 2025 were up 20.7% compared to the same month last year.
Mastering PCB Floor Planning
08/28/2025 | Stephen V. Chavez, Siemens EDAPlacement of PCB components is far more than just fitting components onto a board. It’s a strategic and critical foundational step, often called “floor planning,” that profoundly impacts the board’s performance, reliability, manufacturability, and cost. Floor planning ties into the solvability perspective, with performance and manufacturability being the other two competing perspectives for addressing and achieving success in PCB design.