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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Scanfil Celebrates 50-Year Journey from Small Workshop to Global Contract Manufacturing Group

06/04/2026 | Scanfil
Scanfil was registered with the Finnish Trade Register on 4 June 1976 when Jorma J. Takanen started operations in his brother's garage in Sievi, Finland.

North American EMS Demand Remains Strong as Book-to-Bill Ratio Hits 1.36 in April

06/01/2026 | Global Electronics Association
The Global Electronics Association announced the April 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.36.

Cicor Wins Major Aerospace & Defence Program in France

05/29/2026 | Cicor
The Cicor Group has been selected by a leading European aerospace & defence (A&D) prime to supply electronic assemblies for a major defence program. This program will be executed by Cicor France at former Éolane sites.

Technica Tech Day Event on AI and the Large BGA Solution Hits the Mark

05/27/2026 | Technica USA
On May 13–14, 2026, Technica USA hosted its Tech Day Event in San Jose, California, bringing together more than 25 companies and over 60 attendees from across the electronics manufacturing industry. The event focused on how the rapid evolution of artificial intelligence is driving new manufacturing requirements and changing the technologies used for SMT placement, inspection, and process control.

Foxconn's Lishan Academy Project Celebrates Biodiversity Day with Key Results

05/26/2026 | Foxconn
As the world focuses on climate change and biodiversity loss, Foxconn Technology Group, the world's largest technology manufacturing platform service company, responded to the "International Day for Biological Diversity".
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