-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Koh Young Launches Neptune C+ for Dispense Process Inspection at SMTAI
October 4, 2021 | Koh YoungEstimated reading time: 2 minutes
Koh Young, the industry leader in True3D™ measurement -based inspection solutions, is excited to announce the launch of its new Neptune C+ for dispensing process inspection (DPI) in booth 3319 at SMTA International being held November 1-4, 2021 at the Minneapolis Convention Center in Minnesota. As the Premiere Sponsor for SMTA International, Koh Young America is excited to reconnect and collaborate in-person, while ensuring COVID safety protocols are implemented and upheld for your health and ours.
Neptune C+: Industry’s first True3D In-Line Dispense Process Inspection (DPI) Solution
Conformal coatings protect electronics from moisture, debris, corrosion, and add s mechanical stability to reduce failures and improve harsh environment reliability. But what if the coating is too thin or defective? Failure!
Traditional laser-confocal and electron microscopes only measure three-dimensional shapes and cannot inspect transparent materials. The penetration depth is just too shallow. Optical systems use UV light , but only for simple 2D presence.
Our L.I.F.T. technology (Laser Interferometry for Fluid Tomography) delivers non - destructive 3D inspection to precisely measure wet/dry fluids, including material thickness – all at production speeds. Based on low-coherence interferometry, LIFT employs Near-Infrared Light (NIR) to capture images through multiple layers of a fluidic structure regardless of transparency.
As such, the Neptune is the industry’s first 3D optical inline measurement solution for transparent material inspection. With its integrated flippe r, intuitive programming, and machine-learning algorithms, it allows manufacturers to explore the depths of its process using 2D, 3D, and cross-section views to accurately identify defects at full production speed.
With advanced algorithms to teach inspection parameters, Neptune accurately measures materials for coverage, thickness, and consistency using a user-defined threshold setting. It also inspects bubbles, cracks, and other defects – even “keep out” areas with 50-micron splash marks.
Besides coatings, it measures under?ll, epoxy, bonding, and more to deliver an accurate measurement of transparent, translucent, and pigmented materials. The system is currently suited for acrylic, silicone, polyuret hane, water-based, UV- cure, and hybrid coatings. The Neptune is the industry’s first True3D optical measurement solution for transparent material inspection and solves a long-standing industry challenge.
To learn more about these award-winning technologies from Koh Young, visit us at SMTA International in booth 3319. You can register to attend the in -person conference and exposition at smta.org/mpage/smtai. If you cannot attend, you can still learn more about our best-in-class inspection solutions at our regional website www.kohyoungamerica.com.
Be sure to check out the free 12-part Webinar Series Converting Process Data Into Intelligence, presented by Koh Young experts Joel Scutchfield and Ivan Aduna and download Koh Young's free eBooks The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond published by I-Connect007.
Suggested Items
Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency
11/21/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced that Sat Nusapersada, one of the largest Electronics Manufacturing Services (EMS) providers in Indonesia, has adopted its Process Preparation software to reduce its timescale for New Product Introduction (NPI) of printed circuit board assemblies and improve the efficiency of its Surface Mount Technology production lines by 23 percent.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.
Automating Test Processes in Modern PCBA Manufacturing
11/12/2024 | Josh Casper, Horizon SalesICT and functional test play critical roles in the electronics manufacturing process. In many cases, these processes are the final line of defense in identifying defects, preventing failures from reaching the end user, and safeguarding a manufacturer's reputation. A growing problem in this area has been the sheer increase in production output from the SMT line. As components get smaller, PCBs will continue shrinking, allowing engineers to design highly panelized products.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/08/2024 | Nolan Johnson, I-Connect007In our industry we work on solutions. This week, solutions are represented in these must-read choices. Solid state batteries make an appearance, as does LED imaging equipment at American Standard Circuits. SPEA’s AI-based optical inspection is here, as are Happy Holden’s recent article on one key engineering skill and news about a flagship R&D facility funded by the U.S. CHIPS Act.