-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Novel Beamforming Network Solution for Single Layer Printed Circuit Board Implementation
October 7, 2021 | Tokyo Institute of TechnologyEstimated reading time: 2 minutes

Wireless technology is responsible for enabling pivotal innovations such as radio and satellite communication. Central to these systems are antennas that can transmit and receive signals. As the scope of wireless technology continues to grow, the next generation of wireless systems requires multibeam antennas that are capable of efficiently handling multiple beams. To maintain stable and reliable connections between transmitters and receivers, these multibeam antennas use beamforming networks (BFNs) like the Butler and Nolen matrices. These BFNs control and direct output signals using a combination of electrical components including phase shifters and directional couplers. The type of BFNs used determines the structure of the circuit and the number of layers the circuit would need to generate a certain number of beams.
BFNs have become even more necessary for implementing 5G technology in the millimeter-wave range as these waves are much more prone to interference. This has led researchers to look into BFNs and improve them to provide low cost-solutions for single-layer printed circuit board (PCB) implementation. In other words, the goal is to produce a configuration with the maximum number of beams and the lowest number of layers.
Now in a study published in IEEE Journal of Microwaves, scientists from Tokyo Tech, Japan, and the European Space Agency, The Netherlands, have introduced a novel one-dimensional switching matrix that achieves a reduction in the number of layers when compared to conventional matrices. Elaborating their approach, Prof. Jiro Hirokawa from Tokyo Tech explains, "We have numerically found the parameters of the directional couplers (including crossovers) and phase shifters that determine the structure of the circuit for an arbitrary number of beams in the generalized configuration of the orthogonal matrix forming multiple antenna beams. The discovery improves over previously known solutions addressing the specific challenges of planar implementation."
The novel matrix topology overcomes the limitations of conventional beamforming matrices. While Butler matrices are limited in the number of beams they can generate to integer powers of two, the proposed solution can generate an arbitrary number of beams. Unlike Nolen matrices, an even distribution of the signals between the phase shifters and directional couplers is possible, resulting in more uniform output signals.
Compared to the conventional Butler and Nolen matrices, the novel matrix topology also achieves a reduction in the number of layers when the number of beams is five and above, reaching a reduction ratio of 38% with 8 beams. "This reduction ratio is very useful for passive antenna orthogonal beamforming matrices. It is expected to benefit the design of next-generation wireless mobile systems and satellite communication microwave payloads," explains Prof. Hirokawa.
The various improvements to the output signal and the compaction in the number of layers allows the proposed BFN to be implemented in low-cost printed circuit boards, making the manufacture of multibeam antennas for the next-generation wireless systems viable and cost-effective.
Read the original article, here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
ICZOOM Launches PCB & SMT Services to Strengthen One-Stop Electronics Industry Solution at IIC Shenzhen 2025
08/28/2025 | PRNewswireICZOOM Group Inc., a B2B electronic component products e-commerce platform, successfully exhibited at the 2025 International Integrated Circuit & Component Exhibition and Conference (IIC Shenzhen 2025) held from August 26 to 28 at the Shenzhen Convention & Exhibition Center in Futian District.
AT&S Fuels Future Innovation with 'Young Wilds' Program
08/28/2025 | AT&SToday’s ideas are tomorrow’s innovations: Following a successful debut in the financial year 2024/25, the “Young Wilds” program offers ambitious young professionals at AT&S the opportunity to take on responsibility and accelerate their personal and professional growth.
Partnerships Drive Innovation for a Brighter Manufacturing Future
08/26/2025 | Barry Matties, I-Connect007When Schweitzer Engineering Laboratories (SEL) opened its greenfield facility in 2023, it did so with careful attention to choosing its suppliers. In this discussion, Collin Peters, electronics business director for North America at MKS’ Atotech, and Justin Kennedy, manager of engineering at SEL, explore their unique partnership that includes collaborative efforts to develop innovative solutions like the Uniplate® PLBCu6 line.
Eltek Receives Purchase Orders Totaling $2.4 Million From Defense Contractor
08/25/2025 | PRNewswireEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards, announced that it received orders totaling $2.4 million from a defense customer.
TTM Technologies: Bridging East and West with Strategic Expansion
08/25/2025 | Marcy LaRont, I-Connect007As global supply chains shift and demand for supply chain resiliency grows, TTM Technologies is expanding with purpose: bolstering its U.S. presence while maintaining a strong footprint in Asia. With recent moves in Wisconsin and Malaysia, the company is positioning itself to better support customers amid an evolving geopolitical landscape. In this interview, President and CEO of TTM Technologies Tom Edman discusses TTM’s expansion strategy, the future of manufacturing, and his planned retirement after his long tenure at the helm of the company.