Dan’s Biz Bookshelf: 'Hidden Potential: The Science of Achieving Greater Things'
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
It’s Only Common Sense: 20 Lessons in 20 Years—A Career in Common Sense
LPKF Presents Innovations for PCB Manufacturing at productronica 2021
October 13, 2021 | LPKFEstimated reading time: 2 minutes
After months of webinars, online contact, and purely virtual events, LPKF is excited to be present at productronica 2021 – and hopes to greet numerous trade show visitors.
At the trade show, the technology company will present a depaneling automation solution for even faster and more cost-efficient cutting of populated boards with a laser – and easy line integration. A completely new, groundbreaking advancement in laser depaneling technology makes it possible to achieve results with exceptional quality at a higher cutting speed. This is all packed into a new system variant in the proven LPKF CuttingMaster 2000 series – which will be unveiled at the trade show.
Also in store for trade show visitors is a demonstration by LPKF of how quickly and easily printed circuit boards can be manufactured in an in-house lab. The company has been equipping labs and development centers in industry and science with circuit board plotters and laser machines for PCB prototyping as well as equipment for SMT applications for decades. The LPKF ProtoLaser U4 will be on display at the trade show as an example of a laser system for prototyping with, especially sensitive materials. This laser system uses a scanner-guided laser specifically developed for electronics labs with a wavelength in the UV region. It can be used to manufacture high-tech prototypes – without any other tools, masks, or films.
With a space-saving, simple, yet reliable process for advanced packaging of integrated circuits – active mold packaging (AMP) – LPKF is already now participating in the development of the upcoming 6G telecommunications standard.
In the laser plastic welding business unit, LPKF sees a lot of overlap with electronics manufacturing – whether in the welding of PCB housings or in the joining of plastics that enrich the innovative field of e-mobility.
Moreover, LPKF has a genuine world’s first here: with LPKF systems, special LDS materials can now be joined. LDS, which stands for “laser direct structuring,” is a leading process in molded interconnect device technology. With it, conductive traces can be produced right on the surfaces of injection-molded components, thus allowing mechanical and electronic functions to be integrated directly on molded parts. Through the new joining possibility, LPKF is paving the way for more flexibility, miniaturization, and functional integration.
LPKF division LaserMicronics, which offers services in the fields of micromachining of materials and laser plastic welding, will present its services at the trade show booth.
As in previous years, visitors to Productronica will find the laser specialist in its familiar place in Hall B2 at Booth 303.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/29/2025 | Nolan Johnson, I-Connect007This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.
ICZOOM Launches PCB & SMT Services to Strengthen One-Stop Electronics Industry Solution at IIC Shenzhen 2025
08/28/2025 | PRNewswireICZOOM Group Inc., a B2B electronic component products e-commerce platform, successfully exhibited at the 2025 International Integrated Circuit & Component Exhibition and Conference (IIC Shenzhen 2025) held from August 26 to 28 at the Shenzhen Convention & Exhibition Center in Futian District.
AT&S Fuels Future Innovation with 'Young Wilds' Program
08/28/2025 | AT&SToday’s ideas are tomorrow’s innovations: Following a successful debut in the financial year 2024/25, the “Young Wilds” program offers ambitious young professionals at AT&S the opportunity to take on responsibility and accelerate their personal and professional growth.
North American PCB Industry Shipments Up 20.7 Percent in July
08/27/2025 | Global Electronics AssociationThe Global Electronics Association announced today the July 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.00. Total North American PCB shipments in July 2025 were up 20.7% compared to the same month last year.
Mastering PCB Floor Planning
08/28/2025 | Stephen V. Chavez, Siemens EDAPlacement of PCB components is far more than just fitting components onto a board. It’s a strategic and critical foundational step, often called “floor planning,” that profoundly impacts the board’s performance, reliability, manufacturability, and cost. Floor planning ties into the solvability perspective, with performance and manufacturability being the other two competing perspectives for addressing and achieving success in PCB design.