The Power of Consistency: Showing Up Every Day is Half the Battle
The Chemical Connection: Getting the Best from Your Cupric Chloride Etchant
Dan’s Biz Bookshelf: ‘Born to Create’
High Density Packaging User Group Announces Uyemura Membership
October 18, 2021 | HDP User GroupEstimated reading time: 1 minute
High Density Packaging (HDP) User Group is pleased to announce that Uyemura International (Uyemura) has become a member.
“As our focus expands from our traditional stronghold in PCB processes into complex assembly processes – especially the high frequency and medical device arenas - we look forward to working with HDP member companies,” said Rich DePoto, Uyemura Business Development Manager.
“I am pleased to welcome Uyemura to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise in surface treatment processes for electronics will contribute significantly to several of our projects, especially those focused on high frequency applications and emerging technologies,” said Larry Marcanti, Executive Director of HDP User Group.
About Uyemura
Uyemura is a science company founded in 1848, with core competencies in the development, testing, and manufacture of process chemistries for the PCB, semiconductor, sensor, photonics and medical device industries.
Uyemura has often been characterized as a disruptor – (long before that became a popular term!) Many Uyemura products have re-invented the solutions of the past, often dramatically, rendering legacy products obsolete, and establishing new benchmarks for performance, longevity, and cost management.
Uyemura was the first company in the industry to establish a research laboratory (today, there are 5 worldwide) as an institution for interdisciplinary surface treatment research. Our global R&D activities have generously rewarded the Uyemura brand with the confidence of leading OEMs in virtually every sector.
More information can be found at: https://www.uyemura.com/index.html
About HDP
HDP User Group, a global research and development organization based in Round Rock, Texas, is dedicated to reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly. This international industry-led group organizes and conducts R&D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. HDP User Group maintains additional offices in Singapore and Tokyo.
For more information, visit HDP User Group on the Internet at www.hdpug.org.
Share on:
Suggested Items
Merlin Circuit Technology Enhances Solder Mask Coating Technology (LPI)
12/10/2024 | Merlin Circuit TechnologyMerlin Circuit Technology has invested in the latest LPI coating system installing the AHK Atomizer. The AHK spray coating system delivers enhanced capability with improved uniformity of coating on the PCB surface and greater encapsulation of copper features.
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
I-Connect007 Releases New Episode of Meet the Author Podcast: Spotlight on Complex PCB Design
12/10/2024 | I-Connect007I-Connect007 is thrilled to announce the latest installment of its Meet the Author podcast series, hosted by Nolan Johnson. In this episode, Johnson interviews Scott Miller and Brian White of Freedom CAD, who share their expertise on complex PCB design.
Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
12/09/2024 | I-Connect007 Editorial TeamIn this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/06/2024 | Marcy LaRont, I-Connect007This week’s must-reads include a discussion on innovation and embedded components within the layers of a PCB with Accurate Circuit Engineering. We revisit the real cost to manufacture in a case study on how a seemingly small design error can have a dramatic effect on your end customer’s costs. Dan Beaulieu provides this month’s book review highlighting the criticality of fostering creativity in the workplace. Bert Horner of The Test Connection discusses his decision to launch a new, complimentary business venture, The Training Connection; and Ramon Roche of NCAB talks about electric vehicle charging.