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PCB Technologies Implements New Miniaturization Technology
November 2, 2021 | PCB Technologies Ltd.Estimated reading time: Less than a minute
Miniaturization compels us to constantly look for and implement new technologies.
One such technology involves placing components inside the PCB by either embedding or burying passives such as capacitors or resistors as well as active components. PCB Technologies is working on integrating capacitors into the PCB stack up. By building these into predefined layers will help reduce the number of passive SMT (Surface Mounted Technology) components on the PCB outer layers.
PCB Technologies All-in-One approach allows them to be involved from the very earliest stages of PCB design. They can assist with selecting the correct material based on required capacitance for the buried capacitors and needed material thickness for the embedded capacitors.
This technology and process, in turn, allows more efficient utilization of the PCB’s surface and better yield during production. Fewer components on the PCB surface mean it is possible to miniaturize the PCB.
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