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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/14/2026 | Marcy LaRont, I-Connect007
Another week has flown by, and it’s time for the must-read articles and news highlights. This week, I’m putting a spotlight on FUJI PCB and FS Quality, through an interview by Dan Beaulieu with President Tianming Liu, and “the rest of the story” from the EIPC Summer Conference technical sessions. I’m also focusing on a new marketing book by Brittany Martin, and there’s rarely a week when we don’t talk about AI, so I also chose Sean Patterson’s most recent practical advice for PCB fabricators. Though the U.S. has placed a “stay” on CMMC Level 2 certification, it’s still coming for you and your business. If you work in the Mil/Aero space in the U.S., check out what Omega EMS has done to accelerate its compliance. Their wisdom may be worth your time.

Ventec’s Glass-Free Revolution: Smarter Material Data for Next-Gen PCB Designs

08/13/2026 | Ventec
At Ventec, we’re excited to see our Glass-Free Bondply materials now included in the latest release of Polar Instruments’ Speedstack.

Catching Up With FUJI PCB and FS Quality’s President, Mr. Tianming Liu

08/13/2026 | Dan Beaulieu
I recently interviewed Mr. Tianming Liu, founder of FUJI PCB and FS Quality. His company is built by blending Japanese manufacturing discipline, Chinese execution speed, and an unwavering commitment to quality and customer service. His story is anything but ordinary. From studying and working in Japan for more than a decade to transforming a struggling PCB factory into a profitable operation before launching FUJI PCB, he has shown vision, determination, and continuous innovation.

Zhen Ding Reports Record 1H26 Revenue and Gross Margin on AI-Driven Growth

08/12/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global PCB manufacturer, announced its consolidated financial results for the second quarter and first half of 2026.

EIPC Summer Conference 2026: Technical Presentations Tell the Rest of the Story

08/12/2026 | Marcy LaRont, I-Connect007
In early June, the EIPC Summer Conference in Vilnius, Lithuania, featured an impressive group of speakers ranging from PCB suppliers and technical experts to startups and robotics OEMs, the latter of which added a “cool factor” to the meeting’s ambiance with a fully operational, interactive humanoid. After some early coverage of the event, I’m now following up with key takeaways from many of the technical presentations. I regret that I could not cover all speakers in detail, but this will give you a good taste of what you missed in Lithuania in June.
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