Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Rocket Lab Acquires Motiv Space Systems, Adding Mars-Proven Robotics Capabilities

05/27/2026 | Globe Newswire
Rocket Lab Corporation, a global leader in launch services and space systems, announced it has completed the acquisition of Motiv Space Systems, a California-based company specializing in space robotics, motion control systems, and precision mechanisms for spacecraft.

ASE Launches Automated 310mm Panel-Level Packaging to Accelerate AI Innovation

05/27/2026 | BUSINESS WIRE
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. and a leading provider of semiconductor assembly and test services, announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies.

Raytheon Wins Contract to Advance Next-Gen Software-Defined Radar

05/19/2026 | Raytheon Company
Raytheon, an RTX business, has been awarded a contract from the Office of Naval Research to further develop advanced radar software for next-generation naval radars.

PCB East 2026: AI Infrastructure, Advanced PCB Technologies, and the Future of Electronics Manufacturing

05/19/2026 | Doug Dixon, 360Circuits
After attending PCB East 2026, it became clear to me that the electronics industry is entering a major transition driven by AI infrastructure, increasing power density, and growing system complexity, extending far beyond semiconductors alone. What stood out was how critical PCB technology, materials science, thermal management, and advanced manufacturing have become to the future of electronics. The industry is now facing many challenges, including tighter manufacturing tolerances, material shortages, rising costs, and growing pressure to digitally transform engineering and manufacturing operations.

Marcy’s Musings: Additive Processes, Signal Consequences

05/19/2026 | Marcy LaRont -- Column: Marcy's Musings
Signal integrity and additive manufacturing, particularly in metallization, are defining themes in modern PCB design and fabrication. PCB layouts are meticulously engineered systems designed to meet strict electrical and power performance targets. However, achieving those targets does not end at the design stage. Once a design enters fabrication, metallization processes—the precise plating of conductive traces—play a critical role in ensuring that signal speed, reliability, and integrity are achieved in the final physical board.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in