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Aismalibar Gives Address at 2021 Cooling Days Conference
November 10, 2021 | AismalibarEstimated reading time: 1 minute
The Cooling Days conference was launched to ensure that developers and equipment manufacturers are optimally prepared to meet these challenges. Numerous aspects of cooling, especially related to electronic components and PCBs, were analyzed this year’s two-day conference. Experts from Science, industry and research explained the most important basics and presented new processes and products for electronics cooling.
Aismalibar’s Business Development Manager, Uwe Lemke, provided an in-depth presentation, the key focus of which was Aismalibar’s Thermal Interface Material Technologies.
Materials specifically discussed were:
1. BONDSHEET Cured, heat conductive foil with high dielectric strength, silicon-free
- Now available plus adhesive film for easier power module assembly
- Available either single or double-sided adhesive
- Customers can select from different adhesive film manufacturers
- On customer request, foils can be contoured to fit with PCB outline for prototypes and mass production
- This technology is available today and Aismalibar can supply samples and support serial production
2. Dual Thermal Coating, DTC: High thermal conductivity two-layer dielectric bonding construction
- New coating technology under investigation and test at major automotive suppliers for future e-car applications (e.g. low and high voltage inverters / On-Board-Chargers)
- Offers Excellent thermal conductivity with high dielectric strength
- DTC can potentially waive mechanical connections inside power module
3. BONDSHEET Cured plus B-Stage coating, combining best of above two Thermal Interface Technologies (TIM)
- Cured thermally conductive Foil Core combined with B-Stage bonding layer
- Available either single or double sided
- Under Aismalibar development in lab status, early test samples available
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