Dan’s Biz Bookshelf: 'Hidden Potential: The Science of Achieving Greater Things'
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
It’s Only Common Sense: 20 Lessons in 20 Years—A Career in Common Sense
EIPC to Hold Technical Snapshot Webinar on November 24
November 18, 2021 | EIPCEstimated reading time: Less than a minute
EIPC will be holding a live technical webinar featuring Daniel Schulze of Dyconex, Lars Böttcher of Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM, and Michael Schleicher of Semikron Elektronik GmbH.
To be held on November 24, 2021, the webinar will tackle advanced high-density packaging substrates for RF and miniaturization, high-density substrate technologies for fan-out and panel-level packaging, and disruptive approach in the design and tool chain of additively manufactured circuit boards.
For more information or to register, contact eipc@eipc.org.
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