Dan’s Biz Bookshelf: ‘The Future of Sales'
Driving Innovation: Traceability in PCB Production
It’s Only Common Sense: Price—Is That All You’ve Got?
EIPC to Hold Technical Snapshot Webinar on November 24
November 18, 2021 | EIPCEstimated reading time: Less than a minute
EIPC will be holding a live technical webinar featuring Daniel Schulze of Dyconex, Lars Böttcher of Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM, and Michael Schleicher of Semikron Elektronik GmbH.
To be held on November 24, 2021, the webinar will tackle advanced high-density packaging substrates for RF and miniaturization, high-density substrate technologies for fan-out and panel-level packaging, and disruptive approach in the design and tool chain of additively manufactured circuit boards.
For more information or to register, contact eipc@eipc.org.
Share on:
Suggested Items
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
WellPCB, OurPCB Launch Low-Cost PCB Assembly and Custom Cable Assembly Solutions
05/29/2025 | ACCESSWIREWellPCB and OurPCB, world leading PCB manufacturing service providers, announced today that they have officially launched new Low-Cost PCB Assembly Solutions and Custom Cable Assembly services to meet the needs of the electronics manufacturing industry for high cost performance and flexible customization.
Siemens Expands OSAT Alliance Membership to Build Domestic Semiconductor Supply Chains
05/29/2025 | SiemensSiemens Digital Industries Software announced the latest members to join its OSAT Alliance program which enables outsourced semiconductor assembly and test (OSAT) providers to develop, validate and support integrated circuit (IC) package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies and help to build secure domestic semiconductor supply chains.
Standards: The Roadmap for Your Ideal Data Package
05/29/2025 | Andy Shaughnessy, Design007 MagazineIn this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.
High-frequency EMC Noise in DC Circuits
05/29/2025 | Karen Burnham, EMC UnitedEMC isn’t black magic, but it’s easy to understand why it seems that way. When looking at a schematic like that in Figure 1, it looks like you’re only dealing with DC signals all across the board. There’s a 28 VDC input that goes through an EMI filter, then gets converted to 12 VDC power. Except in extremely rare circumstances involving equipment sensitive to magnetostatic fields, DC electricity will never be part of an EMC problem.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in