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EIPC to Hold Technical Snapshot Webinar on November 24
November 18, 2021 | EIPCEstimated reading time: Less than a minute
EIPC will be holding a live technical webinar featuring Daniel Schulze of Dyconex, Lars Böttcher of Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM, and Michael Schleicher of Semikron Elektronik GmbH.
To be held on November 24, 2021, the webinar will tackle advanced high-density packaging substrates for RF and miniaturization, high-density substrate technologies for fan-out and panel-level packaging, and disruptive approach in the design and tool chain of additively manufactured circuit boards.
For more information or to register, contact eipc@eipc.org.
Suggested Items
Sondrel Awarded New Video Processor ASIC Design and Supply Contract
05/09/2024 | SondrelSondrel, a leading provider of ultra-complex custom chips for leading global technology brands, is pleased to announce that it has won a major ASIC design and supply contract for a next generation, video processing chip.
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.