-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
SMTA International In-Person Event Concludes Successfully, On-Demand Conference Commences
November 22, 2021 | SMTAEstimated reading time: Less than a minute

The SMTA announced the successful conclusion of the in-person format of their annual conference and exposition, SMTA International. In conjunction with the co-located Medical Design & Manufacturing (MD&M) Minneapolis, November 2-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN, USA, the combined events brought together several thousand manufacturing professionals to share knowledge and solutions under one roof.
Access to the on-demand format of the SMTA International technical conference opened on Monday, November 15 and continues through December 31, 2021.
The on-demand technical conference features over 120 presentations organized into the following topics: Advanced Packaging Technology, Flux, Solder, Adhesives, Harsh Environment Applications, Inspection / Counterfeit Electronics, Low Temperature Soldering, Manufacturing Excellence, Second-Level Interconnect Reliability, Substrates/PCB Technology, and Technical Innovations.
Live, online Professional Development Courses are also scheduled on various dates extending into 2022. Instructed by industry experts, these courses can be registered for separately or as part of a conference package.
Registration to attend the on-demand conference is open and available online through December 24, 2021.
Next year the SMTA International Conference and Exhibition will be held October 31 – November 3, 2022 at the Minneapolis Convention Center in Minneapolis, MN, USA, and will once again be co-located with Medical Design & Manufacturing (MD&M) Minneapolis.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.