-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Siemens Reconfirms Commitment to Shipbuilding 4.0 with CESENA Opening
November 23, 2021 | SiemensEstimated reading time: 1 minute
Siemens has inaugurated the Center of Excellence of the Naval Sector (CESENA) in Ferrol, Spain, where state-of-the-art facilities are equipped with the latest technologies to improve all phases of the ship design and construction process with the aim of transforming the entire value chain of the shipbuilding industry and boosting its competitiveness.
CESENA joins the network of global Centers of Excellence that Siemens has already established in other shipbuilding communities, including the USA, Germany, India, Australia, China and the United Kingdom. Among other educational and innovation activities, the CESENA will host the Marine Digital Twin training program, which will certify new naval industry professionals around all technologies related to the Digital Twin including naval architecture, structural design, electrical design, mechanical design, simulation, PLM management and Industrial IoT.
The Spanish Association of Naval Architects (AINE) has already awarded Siemens and CESENA project an award as the "Best Company or Institution related to activities in the Maritime Sector". This recognition highlights the capacity of the technology company to lead the modernization of the naval sector in Spain.
The creation of CESENA continues Siemens’ commitment begun in November 2019, when Siemens and Navantia signed an agreement to advance in the digital transformation towards 'Shipyard 4.0', an agreement that has allowed the integral implementation of the Digital Twin in the new F-110 Frigates program and meet the requirements of the Spanish Navy.
In today's race towards sustainable shipping, shipyards need to innovate faster and deliver greener ships that meet stringent safety and environmental standards. As complexity in ship design and construction increases, reaching unprecedented levels, risks and inefficiencies in the current design and manufacturing process need to be minimized. As a result, software is essential to optimize the process, reduce costs and increase productivity without compromising quality.
At CESENA, progress will be made towards the digital transformation of Spanish shipyards through the use of programs and technologies within Siemens’ Xcelerator portfolio, including Siemens’ NX software, Teamcenter® portfolio, OpCenter™ software, Simcenter™ software and Tecnomatix® portfolio.
"CESENA will work on the development of future solutions for the Spanish naval sector and will encourage the collaboration between the different agents of the industry: shipyards, universities, research centers, associations, shipowners and public organizations" said Miguel Ángel López, President of Siemens Spain.
Suggested Items
SP Manufacturing Expands with New Malaysia Plant, Acquires Ideal Jacobs
12/26/2024 | PRNewswireSP Manufacturing (SPM), a leader in Electronic Manufacturing Services (EMS), is strengthening its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and successfully acquiring Ideal Jacobs Corporation.
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.