PVA Receives Patent Optical Bonding Software in Korea
November 23, 2021 | PVAEstimated reading time: 1 minute

PVA, a global supplier of automated dispensing and coating equipment, is pleased to announce that it has patented its optical bonding software in Korea. With the new patent, the software is patented throughout the US, United Kingdom, France, Italy, Germany, Hungary, Portugal and Spain, and now Korea.
PVA's focus on these types of software and hardware tools demonstrate the company’s commitment to developing technology to reduce setup times and take the guesswork out of process and application development for the growing display bonding market. This software feature combined with PVA’s Fluid Flow Vision enables the rapid setup of a critical assembly step for new bonding processes.
The optical bonding software greatly simplifies the bonding process by providing a system that alleviates the guess-work of creating perfect bond sequences from scratch, resulting in less waste and faster time to production.
One of the most crucial and challenging steps in the optical bonding process is the final physical mating of the two substrates (e.g. glass to screen). With this patented feature, the user is able to have complete control over the sequence of events (speeds, distances, dwells, etc.) during this critical bonding step on an actual part in production. Using a single button and visual feedback on-screen, the user easily creates a live bond sequence while the machine is simultaneously learning and recording everything quietly in the background.
After the bond sequence has been completed, control is automatically handed back over to the machine to finish the rest of the bonding process. This “learned” bond sequence is then safely stored and can be easily recalled or modified for even more precise tuning.
Within the countless factors that go into making a perfect bond, this sequence must be highly controlled and finely tuned in order to not cause material leakage, trapped bubbles, or other defects that would result in a bad part. Leveraging this new functionality, users can now rapidly prototype and make production ready bond sequences with ease, providing speed and consistency to a once slow and complicated step in the optical bonding process.
PVA manufactures turnkey solutions that help its customers improve their competitiveness. This is accomplished through engineering robust processes that introduce repeatable results that reduce waste, increase throughput and lower manufacturing costs.
Suggested Items
DuPont/Qnity Innovators in Semiconductor Materials Named 2025 Heroes of Chemistry
06/10/2025 | DuPontDuPont today announced that 13 of its current and former scientists and engineers have been named 2025 Heroes of Chemistry by the American Chemical Society (ACS) for an innovative program that progressed semiconductor lithography.
VeriSilicon’s AI-ISP Custom Chip Solution Enables Mass Production of Customer’s Smartphones
06/09/2025 | BUSINESS WIREVeriSilicon recently announced that its AI-ISP custom chip solution has been successfully adopted in a customer’s mass-produced smartphones, reaffirming the company’s comprehensive one-stop custom silicon service capabilities in AI vision processing.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
Keysight, Synopsys Deliver an AI-Powered RF Design Migration Flow
06/06/2025 | BUSINESS WIREKeysight Technologies, Inc. and Synopsys, Inc. introduced an AI-powered RF design migration flow to expedite migration from TSMC’s N6RF+ process to N4P technology, to address the performance requirements of today’s most demanding wireless integrated circuit applications.
IPC Releases Latest Standards and Revisions Updates
06/05/2025 | IPCEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.