Flexible Thinking: Rules of Thumb: A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
November 26, 2021 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
If you’re in the United States like I am, and if you celebrated with a traditional Thanksgiving dinner, like my family did, then you just might have fallen asleep sitting up in a chair (or in my case, stretched out on the couch) and missed some of the highlights in the news this week. Never fear, I woke up early to bring the top five news items you should know for this week.
We have industry bookings and sales news from IPC, some news from the flex sector, an explanation of induction lamination from Happy Holden, and two different takes on “sustainability.”
North American PCB Industry Sales Up 6% in October
Published November 24
“PCB orders fell slightly in October but remain well above 2020 levels and are 2.3 percent higher than 2019 levels,” said Shawn DuBravac, IPC’s chief economist. Check out the rest of the numbers here.
All Flex Discusses Merger and New Medical Applications
Published November 19
Jamin Taylor sat down with I-Connect007 at a recent technical conference to discuss the All Flex/Printed Circuits merger, as well as some new creative flex applications.
Happy's Tech Talk #2: Induction Lamination
Published November 23
If you thought the lamination process could never change, then think again. In Happy Holden’s second installment of the Tech Talk series, Happy details the induction lamination process. Read on to learn all about this new technology.
Foxconn Shared the Best Practices of Green Chemistry
Published November 22
With the business formula “Sustainability=EPS+ESG,” Foxconn begins to implement the U.N.’s SDGs (sustainable development goals), with an end goal of "responsible production.” Read more about how Foxconn is prioritizing sustainability.
Happy 99th Birthday to Harvey Miller!
Published November 23
Still active in the industry at 99 years old, the I-Connect007 staff is looking forward to the possibility that we’ll see Harvey in San Diego come January. Click through to find our 2016 interiew with Harvey, titled “What a Long, Strange Trip it’s Been—and It’s a Long Way from Being Over.”
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
11/22/2024 | SIAThe Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
Meet Polar's New Product Specialist Jess Hollenbaugh
11/21/2024 | Andy Shaughnessy, I-Connect007At PCB West, I spoke with Jess Hollenbaugh, a recent college graduate who has now joined Polar Instruments. In this interview, she shares her journey from a physics student focused on high-energy astrophysics to her new role at Polar. Her insights provide a glimpse into the dynamic opportunities awaiting those who venture into this evolving industry.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.