-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Solderstar Introducing North America to Latest Profiling Systems at IPC APEX EXPO
November 26, 2021 | SolderStarEstimated reading time: 2 minutes

Following a successful European show at productronica in Germany, Solderstar a leading supplier of profiling equipment for reflow, wave, vapor and selective soldering, is ready to present its latest innovations to the North American region when they attend IPCAPEX EXPO, in San Diego, California from 25-27 January 2022.
Solderstar will put the spotlight on two of the company’s newest products including the VP Nano system and the Solderstar SLX, a state-of-the-art zero set-up thermal profiler.
Chris Williams, Solderstar Business Development Manager said: “Apex will be the first exhibition that Solderstar has attended in America for two years due to the pandemic. We are therefore very much looking forward to sharing our latest products with the electronics industry in this territory.
“We have spent the last two years re-evaluating and reviewing our products. It was the perfect opportunity to spend quality time on new product design and allowed us the opportunity to come up with the new SLX datalogger.
“We collated information from the field teams and of course from our customers, to look at what the industry needed and how the process of thermal profiling could be improved. The feedback we received was for systems to include ease of set up, error-free processing, and for everything to be backwards compatible with the thousands of SMARTLink accessories existing in the market. This created the basis of a new set of goals. Armed with this knowledge and our own objectives to produce best-in-class products the SLX datalogger was conceived. The SLX is a complete ground up design with all aspects of the product improved and redeveloped. SLX maintains compatibility with older products, but importantly offers a powerful platform to build new measurement solutions, with parameter measurements for emerging processes and future capacity.
“What makes Solderstar SLX so unique is that it requires no measurement setup. It is an accurate, robust, ultra-compact, battery-powered datalogger used for measuring and recording process parameters from any soldering process. Since introducing the new product we have received exceptional interest and this will be the main focus for us at Apex.
“The unit can be plugged onto any SMARTLink reflow heatshield or other process accessory and the system will directly read and auto-configure itself to quickly enable the correct number of thermocouples as well as every other process parameter sensor. The user does not have to redefine the system before each use. This feature is a huge benefit to the customer as they can down-skill the profiling workload. Additionally, it has 12 separate memories for individual profiles, so the user only has to go back to the PC and download once they’ve finished profiling every process in the manufacturing area- a great time saver!
“We are very much looking forward to presenting the new SolderStar SLX at Apex, together with our other innovative products.”
As well as introducing visitors to the SLX datalogger, Solderstar will present another new addition, VP Nano. This impressive system allows users of batch and in-line vapor phase soldering machinesto fully profile products in the same way as a conventional reflow oven.
VP Nano features a rechargeable micro-miniature profiling datalogger combined with a sealed light-weight heat shield capable of operating in the pre-heat, vapor reflow and vacuum stages of the machine. Once data capture is complete, the heat shield can be opened and the datalogger removed to allow for rapid cool-down cycles minimizing the risk of overheating the profiling unit.
Suggested Items
Hunting for Clues: Feng Xue Solving Circuit Board 'Crimes' With AOI Standard
05/08/2025 | Linda Stepanich, IPCWhen residents in sleepy English villages needed a top-tier detective to solve a murder, they called on Belgian super-sleuth Hercule Poirot, author Agatha Christie’s fictional detective famous for using his “little grey cells” to solve crimes. In the same way, IPC standards development committees, when creating a standard to detect defects in circuit boards using Automated Optical Inspection (AOI), call on IPC A-Team, Hercule.
IPC Strengthens Global Focus with Promotion of Sanjay Huprikar to Chief Global Officer
05/08/2025 | IPCIPC, the global electronics association, announces the promotion of Sanjay Huprikar to chief global officer. This newly created position reflects the association’s forward-looking strategy and industry needs to strengthen the electronics supply chain.
Navigating Global Manufacturing in an Era of Uncertainty
05/07/2025 | Philip Stoten, ScoopThe EMS industry faces unprecedented challenges as global trade tensions rise and tariff announcements create market uncertainty. In an overview of IPC Europe’s podcast, MADE IN EUROPE, industry experts from GPV and Zollner examine how these developments impact our businesses and customers, and what strategies will prevail in this new landscape.
Nick Koop Launches IPC Flex Design Class
05/06/2025 | Andy Shaughnessy, Design007 MagazineNick Koop is director of flex technology for TTM Technologies, and he’s been a staple of IPC’s flex committees for decades. He’s also a longtime flex design instructor, and he’s about to debut a new IPC class, Flex and Rigid-Flex Design for Manufacturability, which will run May 12–21. In this interview, Nick tells us about this new class and what attendees can expect to learn.
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
05/06/2025 | Chris Mitchell -- Column: The Government CircuitThere is certainly no shortage of work to be done in the IPC Government Relations department, as the U.S. waged a tariff campaign on practically every industrial country in the world and several countries embarked on high-tech initiatives with a mix of approaches to the crucial foundations of electronics manufacturing. Indeed, the breadth and speed of U.S. President Donald Trump’s tariff campaign continues to be a serious challenge for our industry.