-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Winners of IPC Hand Soldering Competition at productronica in Munich, Germany Announced
November 30, 2021 | IPCEstimated reading time: 2 minutes
In cooperation with productronica 2021, IPC hosted the popular Hand Soldering Competition (HSC), on November 16-19. Skilled competitors demonstrated their expertise in hand soldering while competing for cash prizes. The first-in-person trade show held in Germany since the onset of the COVID pandemic, IPC and productronica welcomed 21 hand soldering experts representing 14 electronics companies.
On the winner’s podium at productronica 2021: First: Allison Guermond, Safran Fougères (France), completing her board in 59 minutes with 552 points out of 558 possible points. She received the IPC first place certificate, a cash prize of €300, a soldering station from sponsor Hakko, and a gift from sponsor Almit.
Second: Nathalie Foubert, Safran Fougères (France), completing her board in 59 minutes and 10 seconds with 552 points out of 558 possible points. She received the IPC second place certificate, a cash prize of €200, a soldering station from sponsor Hakko, and a gift from sponsor Almit.
Third: Stéphanie Devy, Thalès Six GTS, Cholet (France), finishing her board in 51 minutes, 45 seconds scoring 545 points out of 558 possible points. She received the third-place certificate from IPC, a cash prize of €100, and a gift from sponsor Almit.
New this year – The IPC award to the best company team
IPC and its partner productronica presented a new award, recognizing the best company team in hand soldering. Companies with two or three competitors were automatically entered in the best company competition. The best company award was determined by the best scores of the contestants from that company. This year, 6 companies competed, with the top prize going to: Safran Fougères (France), with the combined score of 1,104 against a maximum possible score of 1,116, completed within the total combined time of 118 minutes and 10 seconds (maximum time allowed 120 minutes).
IPC would like to thank Polygone CAO, who designed this year’s competition board in accordance with IPC-A-610H criteria and feature 116 components providing a significant challenge to contestants, resulting in only ten of 36 competitors completing the assembly within the time allotted.
IPC-A-610 Master Instructors from IPC licensed master training center in France (IFTEC) and in the Nertherlands (PIEK and ETECH), served as competition judges for this year’s competition.
IPC would like to thank Hand Soldering Competition sponsors for their generous support this year:
- Gold Sponsors: Hakko, Atelier Systems and Thalès.
- Silver Sponsors: Almit GmbH, Optilia, SFM-Société Française de Microscopie, and Polygone CAO
- Local Sponsors: IFTEC, PIEK and ETECH.
The Next HSC competition in Europe will be:
Regional Competition in Germany will take place at Smtconnect in Nurenberg, Germany from May 10-12, 2022.
Suggested Items
Real Time with… IPC APEX EXPO 2024: The Driving World of e-Mobility with Indium
05/08/2024 | Real Time with...IPC APEX EXPOIn the competitive EV market, technology plays a crucial role facing the challenges of infrastructure. As Brian O'Leary explains, Indium's e-Mobility product suite includes proven solder and thermal management products for high reliability.
Real Time with… IPC APEX EXPO 2024: Understanding Objective Evidence in Manufacturing Processes
05/07/2024 | Real Time with...IPC APEX EXPOGraham Naisbitt explains the importance of objective evidence in manufacturing processes, debunking the common misconception that the ROSE test is a cleanliness test. He also discusses the introduction of Rev J, a requirement for measuring ionic contamination on circuit assemblies, and the challenges in accurately measuring contamination. Alternative methods like ion chromatography and the need for updating standards like the ROSE test are mentioned.
Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director
05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.