-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
International Electronics Circuit Exhibition (Shenzhen) Rescheduled to January 2022
December 1, 2021 | HKPCAEstimated reading time: Less than a minute

The organizing committee of the International Electronics Circuit Exhibition has decided to reschedule the 2021 exhibition from 8–10 December 2021 to 5–7 January 2022.
The show venue will remain unchanged in Halls 5–8 of the Shenzhen World Exhibition & Convention Center (Bao’an). The organizers will continue to make every effort to prepare for the exhibition, maintain close communication with all relevant parties, and closely monitor the development of the pandemic. The exhibitors are being encouraged to make corresponding re-scheduling arrangements.
For more information, visit the official website at www.hkpcashow.org and official WeChat at “PCB_SMT” for the latest show update.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Meet with The Test Connection Inc. (TTCI) at SMTA Guadalajara 2025
08/18/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, is pleased to announce its participation at the upcoming SMTA Guadalajara Expo & Tech Forum, taking place September 17–18, 2025, at Expo Guadalajara, Salón Jalisco Hall D & E.
Amidst U.S. Strategy Shift, Foxconn Sells Lordstown, Ohio Plant for $88 Million
08/07/2025 | I-Connect007 Editorial TeamAs part of a strategic shift in its US operations, Taiwan-based Foxconn (Hon Hai Precision Industry’s) subsidiaries are selling off assets at its Lordstown, Ohio, facility, the company announced on Aug. 4.
FuriosaAI Closes $125M Investment Round to Scale Production of Next-Gen AI Inference Chip
07/31/2025 | BUSINESS WIREFuriosaAI, a semiconductor company building a new foundation for AI compute, today announced it has completed a $125 million Series C bridge funding round. The investment continues a period of significant momentum for Furiosa as global demand for high-performance, efficient AI infrastructure soars.
Bell to Build X-Plane for Phase 2 of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
07/09/2025 | Bell Textron Inc.Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 2 of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program with the objective to complete design, construction, ground testing and certification of an X-plane demonstrator.
RTX's Raytheon Awarded $646M Hardware Production and Sustainment Contract for SPY-6 Family of Radars
06/10/2025 | RTXRaytheon, an RTX business, was awarded a $646 million contract to continue producing AN/SPY-6(V) radars for the U.S. Navy. This is the fourth option exercised from the March 2022 hardware, production and sustainment contract that is valued up to $3 billion over five years.