I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 10, 2021 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

Right now, it seems that almost everyone I know is talking about the future. Doesn’t matter whether it’s with my family, loved ones, friends, industry colleagues, or neighbors I meet on the street, conversations are almost entirely forward-looking. This being the holiday season, some reminiscing is to be expected, but I’m just not hearing it in the chatter all around me–this year is different somehow. And it shows in this edition of my must-reads for the week as well.
This week we bring you forward-looking discussions with Dr. John Mitchell, IPC president and CEO, on IPC APEX EXPO and what to expect in the future; and an interview with Isola’s CEO, Travis Kelly, introducing a new industry consortium, the Printed Circuit Board Association of America. Innovative additive technologies gain the spotlight as well, with Nano Dimension and a combination of Averatek and American Standard Circuits leading this week’s news cycle. Wrapping up the theme is Siemens’ position as a visionary in the Industrial IoT Magic Quadrant, as compiled by Gartner.
The Mission of the New Printed Circuit Board Association of America
Published December 9
Barry Matties recently met with Travis Kelly to discuss the formation of the Printed Circuit Board Association of America (PCBAA), a consortium of U.S.-based companies he chairs to support U.S. domestic production of PCBs. PCBAA was established on three pillars, and Travis explains how they intertwine with each other—and with other similar organizations in the industry. This is an important read no matter what sector of the industry you fall in.
John Mitchell: Focus on the Future
Published December 6
In a far-ranging interview, first published in I-Connect007’s December issue of SMT007 Magazine, Dr. John Mitchell and Barry Matties discuss the upcoming IPC APEX EXPO, IPC programs, and the challenges–and opportunities–facing our industry. If you think Dr. Mitchell's assessment would be pessimistic, you'd be wrong.
Nano Dimension Sells Two DragonFly IV 3D-AME Systems to Defense and Government Agencies
Published December 6
Nano Dimension announced that it has sold the first two DragonFly IV 3D-AME printers, in addition to the two machines that have completed beta sites processes with other leading customers. DragonFly IV is an additive manufacturing system for fabrication of electronic devices which deposits materials while concurrently integrating capacitors, antennas, coils, transformers, and electro-mechanical components.
Siemens Positioned in Visionaries Quadrant of Gartner Magic Quadrant for Industrial IoT Platforms
Published December 7
Siemens Digital Industries Software announced it has been positioned by Gartner in the Visionaries Quadrant of the Gartner Magic Quadrant for Industrial IoT platforms. Siemens is positioned as the sole vendor in the “Visionaries” Quadrant in the report on its first participation in the research. Gartner describes Visionaries in a market as the innovators that drive the market forward by responding to emerging, leading-edge customer demands and by offering new opportunities to excel.
American Standard Circuits Utilizes Averatek Process for Medical Technology
Published December 6
CEO Anaya Vardya discusses the addition of the Averatek A-SAP™ to ASC’s offerings. In the news item, Vardya explains, “Our medical electronics customers depend on us to provide them with the most reliable PCBs possible. When dealing with medical products it is not hyperbole to say that it is always a matter of life or death. With the A-SAP manufacturing process ASC can now provide our customers with ultra high-density technology, 25 micron trace and space, and improved reliability, reducing layer counts and micro via lamination cycles, ultimately simplifying the design.”
Suggested Items
Roca Printed Circuits Joins Forces with Epec Engineered Technologies, NetVia
05/14/2025 | Epec Engineering TechnologiesRoca Printed Circuits and Epec Engineered Technologies announced today that Roca has joined forces with Epec’s NetVia Group PCB division in Dallas, expanding the combined organization's ability to deliver a broader range of high-quality printed circuit boards and electronic solutions.
Innovative Technology Advancements in Test: HATS² Technology and Its Impact on Reliability Testing
05/13/2025 | Barry Matties, I-Connect007Ensuring the reliability of printed circuit boards (PCBs) has become increasingly difficult and critical, yet the development of advanced testing methodologies is essential to meeting industry demands and addressing persistent challenges. One significant innovation is the High Acceleration Thermal Shock (HATS²) test system, which transforms how reliability testing is conducted. After 40 years in the testing business at Microtek, Bob Neves is beginning a new journey with his company, Reliability Assessment Solutions Inc. (RAS).
EWPTE 2025: Wire Processing Innovation Driving Technical Dialogue
05/13/2025 | Brittany Martin, I-Connect007From cutting-edge automation to advanced testing and harness assembly solutions, the 2025 Electrical Wire Processing Technology Expo (EWPTE) delivered a packed exhibit floor, robust technical programming, and valuable peer-to-peer connections.
Beyond the Board: Empowering the Next Generation of Tech Innovators in Electronics
05/13/2025 | Jesse Vaughan -- Column: Beyond the BoardThe electronics industry is at the heart of technological progress, driving innovative advancements that shape our world. Yet, despite the sector's rapid evolution, it faces a looming challenge: attracting and retaining young talent. With an aging workforce and an increasing demand for skilled professionals, the industry must find ways to inspire the next generation of innovators.
Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand
05/13/2025 | Prashant Patel -- Column: Facing the FutureInnovations that push the boundaries of connectivity shape the future of technology, processing power, and miniaturization. 5G and emerging 6G technologies are critical in transforming industries from telecommunications and healthcare to autonomous systems. This affects the printed circuit board (PCB) industry, where demand for high-performance, miniaturized, and advanced PCBs is surging. This column explores the key applications of 5G and beyond, the challenges in designing high-frequency PCBs, the effects of miniaturization, industry collaborations, and opportunities for North American companies in this space.