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We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 10, 2021 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

Right now, it seems that almost everyone I know is talking about the future. Doesn’t matter whether it’s with my family, loved ones, friends, industry colleagues, or neighbors I meet on the street, conversations are almost entirely forward-looking. This being the holiday season, some reminiscing is to be expected, but I’m just not hearing it in the chatter all around me–this year is different somehow. And it shows in this edition of my must-reads for the week as well.
This week we bring you forward-looking discussions with Dr. John Mitchell, IPC president and CEO, on IPC APEX EXPO and what to expect in the future; and an interview with Isola’s CEO, Travis Kelly, introducing a new industry consortium, the Printed Circuit Board Association of America. Innovative additive technologies gain the spotlight as well, with Nano Dimension and a combination of Averatek and American Standard Circuits leading this week’s news cycle. Wrapping up the theme is Siemens’ position as a visionary in the Industrial IoT Magic Quadrant, as compiled by Gartner.
The Mission of the New Printed Circuit Board Association of America
Published December 9
Barry Matties recently met with Travis Kelly to discuss the formation of the Printed Circuit Board Association of America (PCBAA), a consortium of U.S.-based companies he chairs to support U.S. domestic production of PCBs. PCBAA was established on three pillars, and Travis explains how they intertwine with each other—and with other similar organizations in the industry. This is an important read no matter what sector of the industry you fall in.
John Mitchell: Focus on the Future
Published December 6
In a far-ranging interview, first published in I-Connect007’s December issue of SMT007 Magazine, Dr. John Mitchell and Barry Matties discuss the upcoming IPC APEX EXPO, IPC programs, and the challenges–and opportunities–facing our industry. If you think Dr. Mitchell's assessment would be pessimistic, you'd be wrong.
Nano Dimension Sells Two DragonFly IV 3D-AME Systems to Defense and Government Agencies
Published December 6
Nano Dimension announced that it has sold the first two DragonFly IV 3D-AME printers, in addition to the two machines that have completed beta sites processes with other leading customers. DragonFly IV is an additive manufacturing system for fabrication of electronic devices which deposits materials while concurrently integrating capacitors, antennas, coils, transformers, and electro-mechanical components.
Siemens Positioned in Visionaries Quadrant of Gartner Magic Quadrant for Industrial IoT Platforms
Published December 7
Siemens Digital Industries Software announced it has been positioned by Gartner in the Visionaries Quadrant of the Gartner Magic Quadrant for Industrial IoT platforms. Siemens is positioned as the sole vendor in the “Visionaries” Quadrant in the report on its first participation in the research. Gartner describes Visionaries in a market as the innovators that drive the market forward by responding to emerging, leading-edge customer demands and by offering new opportunities to excel.
American Standard Circuits Utilizes Averatek Process for Medical Technology
Published December 6
CEO Anaya Vardya discusses the addition of the Averatek A-SAP™ to ASC’s offerings. In the news item, Vardya explains, “Our medical electronics customers depend on us to provide them with the most reliable PCBs possible. When dealing with medical products it is not hyperbole to say that it is always a matter of life or death. With the A-SAP manufacturing process ASC can now provide our customers with ultra high-density technology, 25 micron trace and space, and improved reliability, reducing layer counts and micro via lamination cycles, ultimately simplifying the design.”
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/13/2025 | Marcy LaRont, I-Connect007Today is Friday the 13th, and in much of Western folklore, this is a day when bad luck is lurking. But while Friday the 13th may top Western superstition charts, the global calendar is sprinkled with its own unlucky legends. In Spain and Greece, the bad juju lands on Tuesday the 13th—a day linked to Mars, the god of war, and naturally, chaos. In Italy, it’s Friday the 17th that is feared, thanks to the Roman numeral XVII, which can be rearranged to spell VIXI—Latin for “I have lived” (a poetic way of saying you’re dead).
Priority Software Appoints Ben Karniel as Chief Revenue Officer to Spearhead Global Growth
06/12/2025 | Priority SoftwarePriority Software, a leading provider of scalable and agile cloud-based business management solutions, proudly announces the appointment of Ben Karniel as its new Chief Revenue Officer (CRO), effective May 1, 2025. This strategic addition to the executive team underscores Priority's commitment to expand its global footprint.
Roll-to-Roll Technologies for Flexible Devices Set to Grow at 11.5% CAGR
06/11/2025 | GlobeNewswireAccording to the latest study from BCC Research, the “Global Markets for Roll-to-Roll Technologies for Flexible Devices” is expected to reach $69.8 billion by the end of 2029 at a compound annual growth rate (CAGR) of 11.5% from 2024 to 2029.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
Bridging the Knowledge Gap in Test: A Conversation with Bert Horner
06/11/2025 | Barry Matties, I-Connect007Bert Horner is a seasoned industry veteran and co-creator of The Test Connection, Inc. (TTCI), a test and inspection company spanning over 45 years. In this candid conversation, Bert reflects on the challenges our industry faces with the retirement of career professionals and the subsequent loss of critical tribal knowledge. As he unveils The Training Connection’s innovative training initiatives, Bert emphasizes the importance of evolving educational programs that align with industry needs, particularly in design for test (DFT), and sheds light on strategies being implemented to foster the next generation of engineers.