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December 2021 Issue of PCB007 Magazine Available Now
December 16, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Robert Plant could have been talking about trade shows when he sang, “It’s been a long time since I did the stroll.” When was the last time you did the stroll down the aisles of a trade show?
So, we’re all excited about the upcoming IPC APEX EXPO 2022 at the San Diego Convention Center. It's now less than six weeks away and we're looking forward to joining you all to celebrate the return of trade shows to our industry.
In the December issue of PCB007 Magazine, we provide you with a preview of what you can expect in San Diego. We have interviews with fabricators and suppliers who are exhibiting and presenting classes at IPC APEX EXPO. IPC show managers discuss the events planned for this year’s event, and we share a variety of conversations with those involved in IPC’s STEM program, including a local high school teacher whose students are now planning engineering careers after being inspired by last year’s STEM event.
Preview or download your PDF copy today on the virtual newsstand or subscribe here for delivery in your e-mailbox.
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Julia McCaffrey - NCAB GroupSuggested Items
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.