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December 2021 Issue of PCB007 Magazine Available Now
December 16, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

Robert Plant could have been talking about trade shows when he sang, “It’s been a long time since I did the stroll.” When was the last time you did the stroll down the aisles of a trade show?
So, we’re all excited about the upcoming IPC APEX EXPO 2022 at the San Diego Convention Center. It's now less than six weeks away and we're looking forward to joining you all to celebrate the return of trade shows to our industry.
In the December issue of PCB007 Magazine, we provide you with a preview of what you can expect in San Diego. We have interviews with fabricators and suppliers who are exhibiting and presenting classes at IPC APEX EXPO. IPC show managers discuss the events planned for this year’s event, and we share a variety of conversations with those involved in IPC’s STEM program, including a local high school teacher whose students are now planning engineering careers after being inspired by last year’s STEM event.
Preview or download your PDF copy today on the virtual newsstand or subscribe here for delivery in your e-mailbox.
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10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
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