Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
Facing the Future: Successfully Navigating the Uncertain Path Ahead
It’s Only Common Sense: Going After the Small Wins Fosters a Winning Culture
Bowman Technical Team Appoints Principal Engineer
December 20, 2021 | BowmanEstimated reading time: Less than a minute
Bowman, a US manufacturer of XRF quality control instruments, has announced a principal addition to its headquarters organization.
Xin Jiang joined the company as Principal Electrical/Firmware Engineer. He holds an MSE (Master of Science, Electrical Engineering) and has 30+ years of experience in digital circuits, embedded software, and product design. He has an impressive record with UL, CE, and FDA compliance and testing, and will lead Bowman’s effort in designing electronics for automated XRF tools and next-generation instruments.
In his previous posts, he specialized in HPLC chromatography and X-ray technology for medical device applications, and was a consulting test engineer for Teradyne, a semiconductor test equipment provider.
His responsibilities at Bowman cover firmware, product design, and regulatory compliance; he reports to Engineering Manager, Robert Magyar.
Bowman is a leading manufacturer of precision XRF plating measurement systems, providing equipment evaluation, selection, commissioning, maintenance and quality systems modernization throughout North America, South America, and Eurasia.
Share on:
Suggested Items
Electronic System Design Industry Posts $4.9 Billion in Revenue in Q4 2024
04/15/2025 | SEMIElectronic System Design (ESD) industry revenue increased 11% to $4,927.3 million in the fourth quarter of 2024 from the $4440.9 million reported in the fourth quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.
Würth Elektronik ICS at PCIM Europe 2025
04/14/2025 | Wurth ElektronikWürth Elektronik ICS will be exhibiting at PCIM in Nuremberg from 6 to 8 May 2025. The specialist for PCB connection solutions in the high-current sector and inventor of Powerelements will be focussing on power electronics at exhibition stand 337 in hall A6.
EDA Tools and RF Design Techniques
04/14/2025 | Andy Shaughnessy, Design007 MagazineHigh-speed PCB design is complex enough, but RF design can be a whole new ball game. RF designers have to contend with tuning and other ideas that traditional PCB designers don’t have to worry about, as well as crosstalk, parasitic capacitance, and material limitations. Most PCB design tool companies now offer RF design options, so designers no longer have to use pureplay RF design tools for anything but the most cutting-edge designs. Cadence Design Systems expanded its RF EDA offerings by acquiring the RF software company AWR a few years ago. We asked David Vye, product management director at Cadence, to share his thoughts on EDA software, RF design, and what new RF designers and engineers need to understand.
Avnet Technology Links STMicroelectronics’ STM32 Microcontrollers
04/11/2025 | AvnetDesign engineers who struggle with chip down design will now be able to quickly prototype and deploy their projects based on STM32 series of microcontrollers, specifically the STM32F7 and STM32N6 series.
The Key to First-pass Success in PCB Design
04/10/2025 | Gerry Partida, Summit InterconnectIn the dynamic world of PCB manufacturing, achieving first-pass success hinges on more than just cutting-edge equipment and skilled teams. At Summit Interconnect, we have seen countless successful launches of advanced HDI designs that can be traced directly to engagement between designers and fabricators early in the design phase. Unfortunately, collaboration in the PCB industry often begins only after problems arise—such as field failures, assembly fallout, or low fabrication yields. This reactive approach is the wrong starting point for collaboration.