Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
Happy’s Tech Talk #38: Novel Metallization for UHDI
It’s Only Common Sense Mastering the Follow-Up—The Key to Closing More Deals
Bowman Technical Team Appoints Principal Engineer
December 20, 2021 | BowmanEstimated reading time: Less than a minute
Bowman, a US manufacturer of XRF quality control instruments, has announced a principal addition to its headquarters organization.
Xin Jiang joined the company as Principal Electrical/Firmware Engineer. He holds an MSE (Master of Science, Electrical Engineering) and has 30+ years of experience in digital circuits, embedded software, and product design. He has an impressive record with UL, CE, and FDA compliance and testing, and will lead Bowman’s effort in designing electronics for automated XRF tools and next-generation instruments.
In his previous posts, he specialized in HPLC chromatography and X-ray technology for medical device applications, and was a consulting test engineer for Teradyne, a semiconductor test equipment provider.
His responsibilities at Bowman cover firmware, product design, and regulatory compliance; he reports to Engineering Manager, Robert Magyar.
Bowman is a leading manufacturer of precision XRF plating measurement systems, providing equipment evaluation, selection, commissioning, maintenance and quality systems modernization throughout North America, South America, and Eurasia.
Share on:
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.
The Right Blend: Mixed Wireless Technologies
05/08/2025 | Kirsten Zima, Siemens EDAA common trend recently is to employ as many radios as possible on a single PCB. With the increase of wireless standards and the downscaling of PCB size, it can be difficult to know what the most critical design parameters are to focus on. In this article, we’ll discuss the most important considerations to make when designing with mixed wireless technologies, such as Bluetooth, GPS, and Wi-Fi, on a single PCB. These considerations include antennas, frequencies, FCC compliance, shielding, and layout with and without transition vias.
ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies
05/06/2025 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions, is thrilled to introduce its new Reliability and Solutions (R&S) service.
PCB East Continues to Expand
05/06/2025 | Andy Shaughnessy, Design007 MagazineIt was a perfect week for a conference and trade show in metropolitan Boston, with high temperatures in the 70s. PCB East took place at the Boxboro Regency Hotel and Conference Center April 29–May 2, with the expo on April 30. PCB East has been expanding since its relaunch a few years ago, with conference and show attendance rising each year.